Huawei’s chip-making subsidiary, HiSilicon is expected to rise its shipment of application processors this year, powering nearly 70% of Huawei smartphones.
“HiSilicon is able to ramp up its AP shipments as Huawei has been using more of its chips to power its high-end smartphones, while also raising the ratio of chips from HiSilicon for its entry-level to mid-range models – a segment where Huawei is expected to see its shipments decrease 5% on year in the second half of 2019” Digitimes Research estimates.
According to the report, HiSilicon’s AP shipments will account for 20% of the total smartphone AP demand in China in 2019.
Back in June, Huawei launched its second 7nm mobile processor – Kirin 810 for mid-range smartphones that’s built with Huawei’s self-developed Da Vinci Neural Processing Unit (NPU) architecture that significantly improves Artificial Intelligence tasks processing.
In September the company launched the first-ever 5G modem embedded System on Chip solution – Kirin 990 5G for its flagship smartphones, this chip also has a 4G variant.
“HiSilicon launched Kirin 990 5G, its first 5G SoC, in September featuring a neural-network processing unit (NPU), and it is expected to continue releasing NPU-focused 5G SoCs as a means to significantly ramp up its AP shipments in the first half of 2020,” it added.
A recent report says, ARM, the British chip design maker firm, will resume its supplies to Huawei that was halted after the US trade ban. And this resumption in supply will help the company to continue producing new chips in the upcoming year.