Big chip makers including TSMC and Intel are pouring money into their plans to expand advanced packaging to raise their stacks over the market. Advanced packaging...
China’s patent office recently published a new Huawei chip packaging technology patent with application number CN116547791A. The title is “a chip package and a Method for...
A few days ago, the world’s largest semiconductor producer – Taiwan Semiconductor Manufacturing Co (TSMC) inaugurated a brand new global R&D center in Hsinchu, Taiwan. The...
During the recent 2023 World Semiconductor Conference and Nanjing International Semiconductor Expo in China, Huawei showcased its EDA solutions to build semiconductor technologies. According to the...
Samsung and TSMC are currently in a neck-to-neck fight but a report suggests that the South Korean company now has an upper hand in 3nm yield...
Huawei has recently announced a breakthrough in 14nm semiconductor EDA tools and a new report reveals that other Chinese companies are also preparing even advanced chipset...
Recently, the Chinese Patent Department published a new Huawei patent on a chipset packaging technology that could reduce the overall manufacturing cost of the semiconductor. This...
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $119.5 billion during the first quarter of 2023. This notes a decrease of 8.7%...
In the past year, Huawei ramped up efforts to explore the semiconductor world to build its own semiconductor ecosystem, reveals a new report. Digitimes reports, Huawei...
Huawei is planning a secret chip startup that can unleash it from the US Sanctions to some extent. The company has started hammering the Shenzhen ground...
