On December 3, a new Huawei patent entitled “a device for detection chip cracks” was published with announcement number CN1137484895A in China. As per the China Intellectual Property database, the company applied for this patent on May 31, 2019.
This new Huawei chip crack detection device is an invention that can reduce the interference to the functional circuit while realizing crack detection. It seems that now the Chinese tech giant is focusing on-chip technologies.
The patent application reveals that the device includes: a functional circuit (110) and a split detection module (120) located around the functional circuit (110). Among them, the split detection module (120) includes a front-end device layer (121) and a layered structure (122) arranged on the front-end device layer (121).
A wire (L) is formed in the layered structure (122), one or more first capacitors (C1) are formed in the channel device layer (121). The first end of the wire (L) is used to connect the positive pole of the power supply, and the second end of the wire (L) is used to connect the negative pole of the power supply.
The first capacitor (C1) is connected in parallel between the first end of the wire (L) and the wire (L) Between the second ends, a detection interface is provided between the first end and the second end of the wire (L), and the detection interface is used to detect whether the chip is broken
Huawei patents for chip packaging component process:
On November 26, 2021, the Huawei patent entitled to a chip packaging component, an electronic device, and a manufacturing process of the chip packaging component patent has passed and been published with a number CN113707623A in China. This patent technology can better solve part of the heat dissipation problem. (Read more)
(Via – ithome)