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Huawei launches HiSilicon solution based 5G modules for large-scale 5G adoption across industry

At Huawei 5G product and solutions launch event in London, Huawei and industry partners jointly launched a series of industrial and consumer modules developed based on HiSilicon’s 5G pre-module to speed up the large scale adoption of 5G across a variety of industries.

Huawei partnered with Quectel, Changhong Holding Group, AI-Link, China Mobile Group Device, and Smart Chip to launch 5G industrial modules, 5G+8K media modules, 5G electric power modules, and more modules.

The new 5G modules will accelerate the adoption of 5G in various scenarios, including smart manufacturing, multimedia, commercial display, large wall-mounted screen, energy, and transportation. In addition, consumer-level 5G modules for AR/VR and wearable devices will go on the market in March this year.

“5G applications at the early stage should focus on high-value scenarios with common features. HiSilicon provides the standard 5G pre-module for vertical industries and the consumer field to assist module vendors in developing commercial modules. In doing so, the pre-module empowers countless enterprises to build a thriving 5G ecosystem.” noted Veni Shone, President of HiSilicon.

Yang Chaobin, President of Huawei’s 5G Product Line, added: “Thanks to the joint efforts of operators and our partners, we have explored the adoption of 5G in dozens of vertical industries and a growing number of leading module vendors have joined forces with us. I believe that we will witness a boom in the growth of the 5G industry in the near future.”

Huawei said it’ll continue to work with 5G industry partners by providing HiSilicon 5G pre-module to empower scenario-based professional modules on the principle of openness, broad-based compatibility, multi-interface capabilities, and one-stop service, completing the 5G industry chain and expediting the large-scale adoption of 5G in more industries.



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