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Kirin W650 and GigaHome 650: The world’s first Wi-Fi 6+ chips for smartphones and home routers

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On February 24, 2020, Huawei unveiled the industry’s first Wi-Fi 6+ solutions, including the Kirin W650 chip for smartphones and Gigahome 650 chip for home Wi-Fi routers.

Wi-Fi 6 is a new Wi-Fi standard and introduced in 2019. This Wi-Fi standard utilizes new technologies such as orthogonal frequency division multiple access (OFDMA), 1024-state quadrature amplitude modulation (1024-QAM), and Target Wake Time (TWT), to facilitate faster connections. It also helps extend the battery life of connected devices.

The Wi-Fi 6 allows sharing channels in densely connected environments with multiple users and terminals, enhancing network efficiency and lowering latency for both uplink and downlink traffic.

Using Wi-Fi 6 as a base, Huawei has introduced the first-ever Wi-Fi 6+ solutions to boost the new smartphones and smart home connectivity.

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Check the detailed view of Kirin 650 and GigaHome 650 below.

Kirin W650:

Designed especially for smartphones, Kirin W650 supports up to 160 MHz of frequency bandwidth at a peak rate of 2.4 Gbit/s, twice the level of industry specification.

It uses “Dynamic Narrow Bandwidth” technology that adjusts the bandwidth in an environment with poor Wi-Fi signals, and improves performance.

Devices equipped with this technology are capable of passing signals through an additional wall or obstructions, compared to similar devices in the market.

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It has HiEX terminal-pipe synergy, that powers smooth user experience on smartphones and smart home applications, with dynamic interference avoidance. This reduces air-interface latency by 50% in multi-player gaming and online learning scenarios.

With Bluetooth Ultra High-Definition (BT-UHD) technology, the Kirin W650 provides transfer rates three times as high as the standard Bluetooth, support for UHD and lossless audio, instant content transfers from phones to Bluetooth devices, and over the air (OTA) software updates.

In addition, this chip also supports the Global Navigation Satellite System (GNSS) with the widest available satellite standard coverage to date and enables real-time kinematic (RTK) positioning that is repeatedly accurate down to the sub-meter level.

GigaHome 650:

The GigaHome 650 home router chipset is an all one solution for a diverse range of connected devices. The main architecture of chipset includes power line communication (PLC) chip, and CPU chip.

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The Wi-Fi chip supports up to 3 Gbit/s peak throughput, at a peak frequency bandwidth of 160 MHz with two antennas.

Powered by Huawei’s 5G algorithms, this chipset offers attributes such as interference avoidance and multi-user scheduling while integrating 2G and 5G dual-band support in a single chip.

GigaHome 650 has quad-core Cortex-A53 CPU that clocks at up to 1.4Ghz, with the help of a Wi-Fi offloading unit that provides powerful computing performance for a variety of applications installed on the router while allowing a maximum bandwidth of 3 Gbit/s.

The Chinese tech giant says the GigaHome 650 comes with its own level of data security that’s guaranteed by TrustZone technology.

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“These Wi-Fi solutions will take Wi-Fi connectivity to a new level and will deliver seamless Wi-Fi coverage for Internet calling, online gaming, streaming video, online learning, and even working from home.” Huawei.

According to Huawei, the Kirin W650 and GigaHome 650 solutions, will soon be released in smartphones, routers, and other terminal devices.

Most of Deng Li's smartphones are from the Huawei ecosystem and his first Huawei phone was Ascend Mate 2 (4G). As a tech enthusiast, he keeps exploring new technologies and inspects them closely. Apart from the technology world, he takes care of his garden.

Semiconductor

Chipmakers TSMC and UMC continue to rise: Report

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TSMC

Top chipmakers, TSMC (Taiwan Semiconductor Manufacturing Company) and UMC (United Microelectronics Corporation) making the semiconductor industry continue to rise in Q4, say a report. The wafer duo of TSMC (2330) and UMC increased by 10%, up to 20% respectively.

Moving ahead, the power management and driver ICs are still soaring with a possibility of price increase for some products. However, the power management ICs may be out of stock all the way until the second half of next year.

Ups and Downs in Production Capacity:

According to the report, TSMC and UMC’s production capacity will remain tight for this season as well. Besides, a previous report on this matter reveals that TSMC cloud increase price corresponding to the market and customers.

In this line, the new price list has been activated since August for some customers meanwhile some of them will start from October. This new adjustment results in a 15-20 % increment in the mature process and 10% in the advanced process.

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Moving to the UMC, this company also preparing for an increase before the end of the fourth quarter. The new regulation will have an average increase of 10% since November simultaneously increasing some processes by 15%.  With the help of price increases in the semiconductor industry,  the market analyzers forecast that TSMC and UMC’s revenue, gross profit margin, and net profit after tax will continue to rise.

 IC Chips and Design:

The report further reveals that the Taiwanese chip boundaries are rising chip foundries and launching countermeasures. Furthermore, the chip price increase from anonymous IC design firms in the first half has been shown on the packaging and testing of the products.

TSMC

In addition, July, August, September to November, and December are also expected to keep the same flow. If the customers want express delivery, they have can only adjust prices for the moment. Besides, the makers also are in negotiation with customers.

For instants, TSMC has increased by 20% while the other manufactures are still considering the price increase strategy. The dilemma is to whether to only increase the price for TSMC invested product of all products coming next.

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Conclusion:

This reports revelers around the power management IC factories in Taiwan alongside Silicon Power, Mota, Zhixin, Analogue, Tongjia, and Hongguan Electronics from China. The foundries are out of print for the power management chips. At the starting of this year, the customers were rushing for almost every item but now they are only demanding some specific parts.

Besides, Novatek and Tianyu are still ruling the driver IC market. And the present conditions aren’t favorable in the TV market so makers are reducing the price. Still, the driver IC inventory occupies small marketing, so that the price increase is acceptable for the customers.

Adding to this, driver chips such as power management ICs are mostly produced by 8-inch factories. However, their production capacity is tight currently. Thus, only some driver IC quotations are likely to be increase prices at present.

(Via- Ithome)

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Huawei developed low-latency image transmission technology, supporting 8K resolution

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Huawei Smart Screen Smart TV 98 inch

Huawei’s chip-making subsidiary, HiSilicon has announced to development of new low-latency image transmission technology to enriches multi-screen devices and enhanced the interactive streams experience.

Although Huawei faces a huge decline of about 88% in 1stQ 2021  but still, it wants to continue the research and development for bringing new technologies in the chip industry.

And now we can see the results of their hard work in the new Huawei HiSilicon image transmission technology to increase the image quality measurements mostly during live broadcasts.

HiSilicon Chips

HiSilicon Image Transmission Technology:

This new technology provides a full stack of solutions for high definition, (HD), ultra high definition (UHD), 4K, and 8K devices. You can see the dried description below-

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  • Lower Latency: HiSilicons’ self-developed HiAir ultra-low latency image transmission technology aims to establish a new standard by the next 3 years. it provides a combined benefit of Huawei Cast Plus, automatic device discovery, minimalist connection, and controlled experience.
  • Protocol Deep Optimization: Huawei designed this technology with the Huawei Cast Plus, DLNA, Miracast, and Lelink.
  • Low Memory Design: The image transmission technology uses lesser memory during processing with strong scalability.
  • High Energy Efficiency Ratio: A User only has to connect the TV USB for electricity supply, during the whole process the temperature won’t go over 40 degrees.
  • UHD Image Quality: This new technology will increase the industry’s image quality performance qualification (PQ) standards and provides the most compatible UHD image for media streaming.

Previous News:

In the previous month, HiSilicon opens the recruitments across various locations mainly including Beijing, Shanghai, Shenzhen, etc, for university freshers to provide them an opportunity to jointly develop future technologies. Furthermore, the recruitment categories include Chip, Hardware, Research, Software, Testing, and System.

It’s reported that Huawei wants to keep researching on chipsets and wants to develop its own semiconductor technologies to shrink dependence on other chip manufacturers.

(Via- Ithome)

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SK Hynix begins 1anm DRAM mass production, aims to complete by the second half of 2021

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Today, the worldwide semiconductor supplier- SK Hynix officially announced that the company has initiated the mass production of 1anm DRAM-based, 8 Gigabit LPDDR4 mobile chip.

Furthermore, it’s the first time in the history of SK Hynix to work o the EUV (Extreme Ultraviolet) device in mass production. Before, the company used lithography technology for its 1ynm DRAM production.

To date, SK Hynix has been introduced three kinds of 10nm DRAM-based mobile chip generation. Stating with 1x, 1y, 1z, and now the company is bringing 1anm, which is expected to reach the smartphone manufacturers by the second half of 2021.

The company believes that the advantage of  EUV equipment in chip production leads to the increased productivity, and further boosts cost competitiveness. The expected increase is 25% in terms of productivity.

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The forthcoming product realizes a 4266Mbp stable transfer rate with 20% of reduced power consumption. Apart from this, the company also plans to implement the 1anm technology to DDR5 device debuted in October 2020 in the coming year.

The Vice-President of the company- Cho Youngmann stated that the 1anm DRAM features the most advanced technology with the reduced investment will serve the company in two aspects. First, it’ll bring high profitability, and secondly, it’ll help the company to position itself as the leading technology.

To be mentioned, LPDDR4 stands for Low Power Double Data Rate, which is the fourth generation of the 10nm process technology. This chip is specially designed for smartphone devices.

About SK Hynix:

The SK Hynix is a well-known South Korean firm that works on the manufacture and sales of semiconductor devices. It’s a worldwide provider of mobile chips, which mainly includes Dynamic Random Access Memory chips (DRAM), flash memory chips (NAND Flash), and CMOS Image Sensors (CIS).

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(Via- SKhynix)

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