Semiconductor
Kirin W650 and GigaHome 650: The world’s first Wi-Fi 6+ chips for smartphones and home routers
On February 24, 2020, Huawei unveiled the industry’s first Wi-Fi 6+ solutions, including the Kirin W650 chip for smartphones and Gigahome 650 chip for home Wi-Fi routers.
Wi-Fi 6 is a new Wi-Fi standard and introduced in 2019. This Wi-Fi standard utilizes new technologies such as orthogonal frequency division multiple access (OFDMA), 1024-state quadrature amplitude modulation (1024-QAM), and Target Wake Time (TWT), to facilitate faster connections. It also helps extend the battery life of connected devices.
The Wi-Fi 6 allows sharing channels in densely connected environments with multiple users and terminals, enhancing network efficiency and lowering latency for both uplink and downlink traffic.
Using Wi-Fi 6 as a base, Huawei has introduced the first-ever Wi-Fi 6+ solutions to boost the new smartphones and smart home connectivity.
Check the detailed view of Kirin 650 and GigaHome 650 below.
Kirin W650:
Designed especially for smartphones, Kirin W650 supports up to 160 MHz of frequency bandwidth at a peak rate of 2.4 Gbit/s, twice the level of industry specification.
It uses “Dynamic Narrow Bandwidth” technology that adjusts the bandwidth in an environment with poor Wi-Fi signals, and improves performance.
Devices equipped with this technology are capable of passing signals through an additional wall or obstructions, compared to similar devices in the market.
It has HiEX terminal-pipe synergy, that powers smooth user experience on smartphones and smart home applications, with dynamic interference avoidance. This reduces air-interface latency by 50% in multi-player gaming and online learning scenarios.
With Bluetooth Ultra High-Definition (BT-UHD) technology, the Kirin W650 provides transfer rates three times as high as the standard Bluetooth, support for UHD and lossless audio, instant content transfers from phones to Bluetooth devices, and over the air (OTA) software updates.
In addition, this chip also supports the Global Navigation Satellite System (GNSS) with the widest available satellite standard coverage to date and enables real-time kinematic (RTK) positioning that is repeatedly accurate down to the sub-meter level.
GigaHome 650:
The GigaHome 650 home router chipset is an all one solution for a diverse range of connected devices. The main architecture of chipset includes power line communication (PLC) chip, and CPU chip.
The Wi-Fi chip supports up to 3 Gbit/s peak throughput, at a peak frequency bandwidth of 160 MHz with two antennas.
Powered by Huawei’s 5G algorithms, this chipset offers attributes such as interference avoidance and multi-user scheduling while integrating 2G and 5G dual-band support in a single chip.
GigaHome 650 has quad-core Cortex-A53 CPU that clocks at up to 1.4Ghz, with the help of a Wi-Fi offloading unit that provides powerful computing performance for a variety of applications installed on the router while allowing a maximum bandwidth of 3 Gbit/s.
The Chinese tech giant says the GigaHome 650 comes with its own level of data security that’s guaranteed by TrustZone technology.
“These Wi-Fi solutions will take Wi-Fi connectivity to a new level and will deliver seamless Wi-Fi coverage for Internet calling, online gaming, streaming video, online learning, and even working from home.” Huawei.
According to Huawei, the Kirin W650 and GigaHome 650 solutions, will soon be released in smartphones, routers, and other terminal devices.
3nm is the next stop for mobile chipsets and Taiwan’s TSMC will rip off Samsung for 3nm chipset orders from customers such as Apple, Qualcomm, and MediaTek.
According to a report from Taiwanese media, experts in the study of semiconductors revealed that the current 3nm yield rate is estimated to be about 60% to 70%, or even more than 70%.
Another multinational industry analyst estimated that the current yield rate of TSMC’s 3nm process may fall to about 75%-80%. “There has been such progress in the early stage, which is very impressive.”
The latest input suggests that TSMC has taken the lead in 3nm chip orders and rip off most of the orders from Samsung. In June 2022, Samsung became the first foundry business to announce the initial production of its 3nm process node.
At that time, Samsung’s 3nm yield rate was less than 20 percent and some wafers even had a yield rate of only 10 percent. An industry analyst says, Samsung actually doesn’t know where the fault is.
TSMC says its 3nm process is the most advanced semiconductor technology in both power, performance, and area (PPA). In transistor technology, and a full-node advance from the 5nm generation.
Compared to the 5nm (N5) process, the 3nm process offers up to 1.6X logic density gain and 30-35% power reduction at the same speed and supports the innovative TSMC FINFLEX architecture.
Apple, MediaTek, and Qualcomm:
After Huawei HiSilicon‘s exit, TSMC’s market share was reduced because it was one of the biggest chip customers.
Still, Apple, MediaTek, Qualcomm, AMD, and Nvidia are the top customer of TSMC and Samsung Foundry business. These clients require various chip nodes throughout the year. While, Apple may still be the first to use a 3nm chipset for next year’s iPhones, followed by Qualcomm and MediaTek.
TSMC announced that it is also preparing for 2nm fabs, which will be upgraded six times than the last node process.
Samsung needs to improve:
TSMC is a long-standing chipset printer and Samsung needs to improve its Foundry business to compete against it. That’s all to suggest for the South Korean company.
(source)
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by [email protected] Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.
The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.
Talking about the tipster, [email protected] Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.
According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Huawei HiSilicon:
On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.
In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.
During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.
(Source: ithome)
Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.
This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.
HiSilicon Tianguang 800 chip:
Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Huawei HiSilicon:
Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.
On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.
Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.
(Via: ithome)
