On February 24, 2020, Huawei unveiled the industry’s first Wi-Fi 6+ solutions, including the Kirin W650 chip for smartphones and Gigahome 650 chip for home Wi-Fi routers.
Wi-Fi 6 is a new Wi-Fi standard and introduced in 2019. This Wi-Fi standard utilizes new technologies such as orthogonal frequency division multiple access (OFDMA), 1024-state quadrature amplitude modulation (1024-QAM), and Target Wake Time (TWT), to facilitate faster connections. It also helps extend the battery life of connected devices.
The Wi-Fi 6 allows sharing channels in densely connected environments with multiple users and terminals, enhancing network efficiency and lowering latency for both uplink and downlink traffic.
Using Wi-Fi 6 as a base, Huawei has introduced the first-ever Wi-Fi 6+ solutions to boost the new smartphones and smart home connectivity.
Check the detailed view of Kirin 650 and GigaHome 650 below.
Designed especially for smartphones, Kirin W650 supports up to 160 MHz of frequency bandwidth at a peak rate of 2.4 Gbit/s, twice the level of industry specification.
It uses “Dynamic Narrow Bandwidth” technology that adjusts the bandwidth in an environment with poor Wi-Fi signals, and improves performance.
Devices equipped with this technology are capable of passing signals through an additional wall or obstructions, compared to similar devices in the market.
It has HiEX terminal-pipe synergy, that powers smooth user experience on smartphones and smart home applications, with dynamic interference avoidance. This reduces air-interface latency by 50% in multi-player gaming and online learning scenarios.
With Bluetooth Ultra High-Definition (BT-UHD) technology, the Kirin W650 provides transfer rates three times as high as the standard Bluetooth, support for UHD and lossless audio, instant content transfers from phones to Bluetooth devices, and over the air (OTA) software updates.
In addition, this chip also supports the Global Navigation Satellite System (GNSS) with the widest available satellite standard coverage to date and enables real-time kinematic (RTK) positioning that is repeatedly accurate down to the sub-meter level.
The GigaHome 650 home router chipset is an all one solution for a diverse range of connected devices. The main architecture of chipset includes power line communication (PLC) chip, and CPU chip.
The Wi-Fi chip supports up to 3 Gbit/s peak throughput, at a peak frequency bandwidth of 160 MHz with two antennas.
Powered by Huawei’s 5G algorithms, this chipset offers attributes such as interference avoidance and multi-user scheduling while integrating 2G and 5G dual-band support in a single chip.
GigaHome 650 has quad-core Cortex-A53 CPU that clocks at up to 1.4Ghz, with the help of a Wi-Fi offloading unit that provides powerful computing performance for a variety of applications installed on the router while allowing a maximum bandwidth of 3 Gbit/s.
The Chinese tech giant says the GigaHome 650 comes with its own level of data security that’s guaranteed by TrustZone technology.
“These Wi-Fi solutions will take Wi-Fi connectivity to a new level and will deliver seamless Wi-Fi coverage for Internet calling, online gaming, streaming video, online learning, and even working from home.” Huawei.
According to Huawei, the Kirin W650 and GigaHome 650 solutions, will soon be released in smartphones, routers, and other terminal devices.
HiSilicon Tianguang 800 chipset news is fake: Huawei
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.
The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.
Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.
According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.
In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.
During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.
Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022
Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.
This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.
HiSilicon Tianguang 800 chip:
Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.
On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.
Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.
Huawei and SMIC fab manufacturing news is a rumor: Industry Insider
Recently, some industry insiders confirmed that it is a rumor that Huawei and SMIC will build a wafer fab manufacturing company in China. Just a few days ago, it was reported that Huawei with the help of SMIC develop fab with around ten billion dollars investment.
In addition to this, a report also mentioned at the industry exhibition in Taiwan, the relevant personnel of Huawei and TSMC’s supply chain partners was spotted discussing the equipment purchase for the factory. It is disclosed that SMIC Southern and local government funding and other details.
Regarding this, a person familiar with this matter from Huawei told Chinese media that above the news was false. Meanwhile, several people close to SMIC also mentioned that SMIC never participated in this and assisted Huawei in building any factories.
However, the cooperation between the two parties was a legal and regulatory business activity only at the foundry level, not external, conceived the development of “grouping and warming”.
SMIC and Huawei:
SMIC is the largest wafer fab and contract chip maker in mainland China. To restrict these firms, the US government listed them on the “entity list” and targeted sanctions policies are increasingly being implemented. Since then, Huawei is facing a shortage of core components and finding solutions to overcome them.
So far, Huawei and its allies have been banned from all U.S, which prohibits the companies from purchasing goods made with the country’s manufacturer or supported technologies.
Therefore, SMIC must be licensed to import required components. It is also necessary to apply to the Department of Commerce for advanced technology nodes (10 nanometers or less), direct export of essential goods required for the production of semiconductors will be restricted.
China’s independent supply chain system is still difficult to meet the requirements of Huawei and SMIC. Therefore, the two companies’ operations still need to be enforced in the United States to import certain key products, materials, and equipment.
So, a person familiar with the matter pointed out that, in fact, SMIC and Huawei have maintained long-term and effective communications with the US Department of Commerce, and the two companies have never thought of working behind closed doors.
Even under extreme pressure, Huawei founder Ren Zhengfei has repeatedly stated publicly that Huawei will be more determined to cooperate with US companies and maintain an open attitude. SMIC co-CEO Zhao Haijun once explicitly stated in a financial report briefing that SMIC has maintained a stable cooperative relationship with US suppliers for the past 20 years. Therefore, a large number of US suppliers are the first choice of SMIC.
After getting banned, SMIC and suppliers actively applied for permits for the first time, and the supplier is also updating the progress of permit applications by fab makers. On another level, Huawei and SMIC are among the few domestic semiconductor companies that insist on taking an international route to serve customers around the world.
Among them, SMIC not only helps in the development of domestic design companies but also provides support for the local production of many major international companies. At the same time, in recent years, SMIC, including Beijing, Shanghai, Shenzhen, and many other places, has launched new capacity projects focusing on 28 nanometers and above, and it is impossible for the customer to stop its progress.
If both sides try to break the technical blockade of the United States through cooperation in building factories, this could lead to further sanctions in the United States. Therefore, it is advisable to adopt this method to jeopardize the security of both parties in the operation of the company.