On October 22, at the online global launch conference, Huawei has released the Hisilicon Kirin 9000 5G SoC alongside the Huawei Mate 40 series. However, the base model of the Mate 40 series, the Huawei Mate 40 is powered by the Kirin 9000E chipset.
Both Kirin 9000 and Kirin 9000E are built on TSMC’s cutting edge 5nm process and it includes a 5G modem right into the chip itself. Kirin 9000 series i`s the most full-featured 5G Soc to date, which has the capability to handle multi-tasking operations and delivering improved performance and power efficiency.
Let’s explore these processors in a bit of detail but the thing to note that Kirin 9000 and 9000E have almost the same specs except for the GPU, which varies in both of them.
Kirin 9000 and 9000E Key Specification:
CPU: 1 x Cortex -A77@3.13 GHz, 3 x Cortex-A77@2.54 GHz, 4 x Cortex-A55@2.05 GHz
GPU: 24-core Mali-G78 (Kirin 9000), 22-core Mali-G78 (Kirin 9000E), Kirin Gaming+3.0
AI: Huawei Da Vinci Architecture 2.0, Ascend Lite*2+Ascend Tiny*1
5G: SA & NSA, sub-6G & mmWave
ISP: Kirin ISP 6.0, Quad-pipeline
System Cache: 8MB
Memory: LPDDR 5/4X
Kirin 9000 and 9000E Detailed Specifications:
Kirin 9000 and 9000E chipsets integrated up to 15.3 billion transistors, which makes it the most fully functional 5G SA solution. This powerful series chipset comes with three-level architecture with eight-core CPU parts including a 3.13 GHz Cortex A77 large core and three medium core 2.54GHz A77 and four small core 2.05GHz.
It also integrated with a 24-core Mali-G78 GPU, as well as an innovative NPU featuring two big cores and one tiny core, taking on-device AI to a new level. The 24-core Mali-G78 GPU is to be the most powerful GPU on a Huawei device that provides advanced graphics performance and an amazing gaming experience.
The new Kirin 9000 series increased the number of cores by half and performance is enhanced by 60% as compared to Kirin 990’s Mali-G76.
Adopting Huawei’s in-house Da Vinci Architecture 2.0, Kirin 9000’s NPU accommodates two big cores and one tiny core, offering robust AI compute support for AI video applications with an improved energy efficiency ratio. To maximize Kirin 9000’s photographic capabilities, the NPU is integrated with an embedded Kirin ISP 6.0. This revolutionary ISP+NPU architecture enables HDR video synthesis with real-time exposure, resulting in sharp images and video even in lowlight environments and backlit conditions.
In addition, they are all manufactured with 5nm EUV process, support LPDDR5/4X memory and UFS flash memory, support HiFi sound quality, 4K HDR video, etc
HiSilicon Tianguang 800 chipset news is fake: Huawei
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.
The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.
Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.
According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.
In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.
During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.
Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022
Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.
This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.
HiSilicon Tianguang 800 chip:
Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.
On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.
Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.
Huawei and SMIC fab manufacturing news is a rumor: Industry Insider
Recently, some industry insiders confirmed that it is a rumor that Huawei and SMIC will build a wafer fab manufacturing company in China. Just a few days ago, it was reported that Huawei with the help of SMIC develop fab with around ten billion dollars investment.
In addition to this, a report also mentioned at the industry exhibition in Taiwan, the relevant personnel of Huawei and TSMC’s supply chain partners was spotted discussing the equipment purchase for the factory. It is disclosed that SMIC Southern and local government funding and other details.
Regarding this, a person familiar with this matter from Huawei told Chinese media that above the news was false. Meanwhile, several people close to SMIC also mentioned that SMIC never participated in this and assisted Huawei in building any factories.
However, the cooperation between the two parties was a legal and regulatory business activity only at the foundry level, not external, conceived the development of “grouping and warming”.
SMIC and Huawei:
SMIC is the largest wafer fab and contract chip maker in mainland China. To restrict these firms, the US government listed them on the “entity list” and targeted sanctions policies are increasingly being implemented. Since then, Huawei is facing a shortage of core components and finding solutions to overcome them.
So far, Huawei and its allies have been banned from all U.S, which prohibits the companies from purchasing goods made with the country’s manufacturer or supported technologies.
Therefore, SMIC must be licensed to import required components. It is also necessary to apply to the Department of Commerce for advanced technology nodes (10 nanometers or less), direct export of essential goods required for the production of semiconductors will be restricted.
China’s independent supply chain system is still difficult to meet the requirements of Huawei and SMIC. Therefore, the two companies’ operations still need to be enforced in the United States to import certain key products, materials, and equipment.
So, a person familiar with the matter pointed out that, in fact, SMIC and Huawei have maintained long-term and effective communications with the US Department of Commerce, and the two companies have never thought of working behind closed doors.
Even under extreme pressure, Huawei founder Ren Zhengfei has repeatedly stated publicly that Huawei will be more determined to cooperate with US companies and maintain an open attitude. SMIC co-CEO Zhao Haijun once explicitly stated in a financial report briefing that SMIC has maintained a stable cooperative relationship with US suppliers for the past 20 years. Therefore, a large number of US suppliers are the first choice of SMIC.
After getting banned, SMIC and suppliers actively applied for permits for the first time, and the supplier is also updating the progress of permit applications by fab makers. On another level, Huawei and SMIC are among the few domestic semiconductor companies that insist on taking an international route to serve customers around the world.
Among them, SMIC not only helps in the development of domestic design companies but also provides support for the local production of many major international companies. At the same time, in recent years, SMIC, including Beijing, Shanghai, Shenzhen, and many other places, has launched new capacity projects focusing on 28 nanometers and above, and it is impossible for the customer to stop its progress.
If both sides try to break the technical blockade of the United States through cooperation in building factories, this could lead to further sanctions in the United States. Therefore, it is advisable to adopt this method to jeopardize the security of both parties in the operation of the company.