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Kirin 9000 and 9000E: 5nm, 5G, Cortex A77 CPU, Mali-G78 GPU, Da Vinci Architecture 2.0, Kirin ISP 6.0 and more

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On October 22, at the online global launch conference, Huawei has released the Hisilicon Kirin 9000 5G SoC alongside the Huawei Mate 40 series. However, the base model of the Mate 40 series, the Huawei Mate 40 is powered by the Kirin 9000E chipset.

Both Kirin 9000 and Kirin 9000E are built on TSMC’s cutting edge 5nm process and it includes a 5G modem right into the chip itself. Kirin 9000 series i`s the most full-featured 5G Soc to date, which has the capability to handle multi-tasking operations and delivering improved performance and power efficiency.

Let’s explore these processors in a bit of detail but the thing to note that Kirin 9000 and 9000E have almost the same specs except for the GPU, which varies in both of them.

Know more: Huawei P50 to launch with Kirin 9000, Samsung and OLED LG displays

Kirin 9000 and 9000E Key Specification:

Process: 5nm

CPU: 1 x Cortex [email protected] GHz, 3 x [email protected] GHz, 4 x [email protected] GHz

GPU: 24-core Mali-G78 (Kirin 9000), 22-core Mali-G78 (Kirin 9000E), Kirin Gaming+3.0

AI: Huawei Da Vinci Architecture 2.0, Ascend Lite*2+Ascend Tiny*1

5G: SA & NSA, sub-6G & mmWave

ISP: Kirin ISP 6.0, Quad-pipeline

System Cache: 8MB

Memory: LPDDR 5/4X

Kirin 9000 and 9000E Detailed Specifications:

Kirin 9000 and 9000E chipsets integrated up to 15.3 billion transistors, which makes it the most fully functional 5G SA solution. This powerful series chipset comes with three-level architecture with eight-core CPU parts including a 3.13 GHz Cortex A77 large core and three medium core 2.54GHz A77  and four small core 2.05GHz.

It also integrated with a 24-core Mali-G78 GPU, as well as an innovative NPU featuring two big cores and one tiny core, taking on-device AI to a new level. The 24-core Mali-G78 GPU is to be the most powerful GPU on a Huawei device that provides advanced graphics performance and an amazing gaming experience.

The new Kirin 9000 series increased the number of cores by half and performance is enhanced by 60% as compared to Kirin 990’s Mali-G76.

Adopting Huawei’s in-house Da Vinci Architecture 2.0, Kirin 9000’s NPU accommodates two big cores and one tiny core, offering robust AI compute support for AI video applications with an improved energy efficiency ratio. To maximize Kirin 9000’s photographic capabilities, the NPU is integrated with an embedded Kirin ISP 6.0. This revolutionary ISP+NPU architecture enables HDR video synthesis with real-time exposure, resulting in sharp images and video even in lowlight environments and backlit conditions.

In addition, they are all manufactured with 5nm EUV process, support LPDDR5/4X memory and UFS flash memory, support HiFi sound quality, 4K HDR video, etc

Amy is our firmware and software specialist, she keeps her eagle eyes open for new software rollouts, beta programs, and other software related activities as well as new smartphone launch.

Semiconductor

TSMC will rip off Samsung for 80% of 3nm chipsets

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Samsung TSMC

3nm is the next stop for mobile chipsets and Taiwan’s TSMC will rip off Samsung for 3nm chipset orders from customers such as Apple, Qualcomm, and MediaTek.

According to a report from Taiwanese media, experts in the study of semiconductors revealed that the current 3nm yield rate is estimated to be about 60% to 70%, or even more than 70%.

Another multinational industry analyst estimated that the current yield rate of TSMC’s 3nm process may fall to about 75%-80%. “There has been such progress in the early stage, which is very impressive.”

The latest input suggests that TSMC has taken the lead in 3nm chip orders and rip off most of the orders from Samsung. In June 2022, Samsung became the first foundry business to announce the initial production of its 3nm process node.

At that time, Samsung’s 3nm yield rate was less than 20 percent and some wafers even had a yield rate of only 10 percent. An industry analyst says, Samsung actually doesn’t know where the fault is.

TSMC says its 3nm process is the most advanced semiconductor technology in both power, performance, and area (PPA). In transistor technology, and a full-node advance from the 5nm generation.

Compared to the 5nm (N5) process, the 3nm process offers up to 1.6X logic density gain and 30-35% power reduction at the same speed and supports the innovative TSMC FINFLEX architecture.

Apple, MediaTek, and Qualcomm:

After Huawei HiSilicon‘s exit, TSMC’s market share was reduced because it was one of the biggest chip customers.

Still, Apple, MediaTek, Qualcomm, AMD, and Nvidia are the top customer of TSMC and Samsung Foundry business. These clients require various chip nodes throughout the year. While, Apple may still be the first to use a 3nm chipset for next year’s iPhones, followed by Qualcomm and MediaTek.

TSMC announced that it is also preparing for 2nm fabs, which will be upgraded six times than the last node process.

Samsung needs to improve:

TSMC is a long-standing chipset printer and Samsung needs to improve its Foundry business to compete against it. That’s all to suggest for the South Korean company.

Samsung TSMC

(source)

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HiSilicon Tianguang 800 chipset news is fake: Huawei

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HiSilicon Tianguang 800 fake

Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by [email protected] Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.

The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.

Talking about the tipster, [email protected] Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.

According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.

Huawei HiSilicon:

On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.

In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.

During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.

(Source: ithome)

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Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022

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Huawei HiSilicon Tianguang 800

Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.

This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.

Huawei HiSilicon Tianguang 800

HiSilicon Tianguang 800 chip:

Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.

Huawei HiSilicon Tianguang 800

Huawei HiSilicon:

Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.

On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.

Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.

(Via: ithome)

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