Kirin 820 is a 7nm SoC that integrates 5G modem and supports both non-standalone and standalone as well as TDD/FDD full-frequency bands for reliable and stable 5G connectivity.
The Kirin 820 5G equips with Huawei’s self-developed Da Vinci NPU, enhancing AI computing by 73% by 73% at a lower power consumption compared with its predecessor.
The multi-core performance is improved by 27% compared with the previous generation, demonstrating strong performance and energy efficiency. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0 technology, boosts the performance by 38% and energy efficiency by 39%, enabling uninterrupted gaming experiences.
The chipset has Huawei-developed ISP 5.0, which packs block-matching and 3D filtering (BM3D) image noise reduction. As well as the dual-domain video noise reduction technologies for clearer night-time photos.
Kirin 820 Specifications:
- Process: 7nm
- CPU: 1 x Cortex-A76 Based@2.36GHz + 3 x Cortex-A76 Based@2.22GHz + 4 x Cortex-A55@1.84GHz
- GPU: 6-core Mali-G57, Kirin Gaming+ 2.0
- HUAWEI Da Vinci Architecture, Ascend D110 Lite, HiAI2.0
- Modem:Modem: 2/3/4/5G, SA&NSA fusion network architecture, FDD&TDD Spectrum Access, DSDS3.x
- Kirin ISP5.0: BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
- Memory: LPDDR4X
Kirin 820 Details:
Kirin 820 is the first mid-range 5G chipset, integrating a 5G modem to provide a cost-effective option. It supports both non-standalone and standalone architectures, as well as TDD/FDD full-frequency bands.
With dual-SIM service concurrency enabled by Kirin 820-powered 5G smartphones, consumers are able to play 5G games on one SIM while making VoLTE HD calls and sending SMS messages on the other SIM.
Kirin 820 optimizes 5G communication experience with features including anti-interference capabilities for complex 5G communication environments, an advanced adaptive receiver for high-speed mobile scenarios, and an ability to intelligently select the optimal channel model for high-speed scenarios.
To reduce latency, the SoC achieves the industry-highest 5G network ratio by comprehensively accelerating 5G network searching and handover, and quicken the time for processing large files and videos.
In addition, Kirin 820 supports bandwidth part (BWP) technology, which implements the switching of bandwidth resources with available 5G bandwidths, reducing 5G power consumption and offering a lasting 5G experience.
This mid-range adopts Huawei’s in-house Da Vinci NPU, enhancing AI computing by 73% at a lower power consumption compared with its predecessor.
Octa-Core CPU and New GPU:
Kirin 820 features an octa-core CPU with one high-performance big core, three balanced middle cores, and four energy-efficient little cores. The big and middle cores are customized based on Cortex-A76 and the little cores are customized based on Cortex-A55.
Achieving an operating rate of up to 2.36 GHz, this combination improves the overall multi-core performance by 27% compared with the previous generation. The Mali-G57 GPU boosts the performance by 38% and energy efficiency by 39% for a faster and smoother gaming experience.
Kirin 820 has Gaming+ 2.0, which incorporates newly updated AI frequency modulation scheduling technology. The technology fuses GPU scheduling into the CPU and DDR system frequency modulation scheduling and adds gaming-associated thread optimization technologies to dynamically detect performance bottlenecks.
Moreover, Kirin Gaming+ 2.0 builds a precise performance and power consumption model by learning over 1 million frames of game images for refinements to performance and power consumption scheduling for each frame and in-depth and precise optimization.
Huawei ISP 5.0:
The Huawei-developed ISP 5.0 supports BM3D for professional-level hardware noise reduction and dual-domain video noise reduction, delivering sharp images and videos even in low light environments.
TSMC will rip off Samsung for 80% of 3nm chipsets
According to a report from Taiwanese media, experts in the study of semiconductors revealed that the current 3nm yield rate is estimated to be about 60% to 70%, or even more than 70%.
Another multinational industry analyst estimated that the current yield rate of TSMC’s 3nm process may fall to about 75%-80%. “There has been such progress in the early stage, which is very impressive.”
The latest input suggests that TSMC has taken the lead in 3nm chip orders and rip off most of the orders from Samsung. In June 2022, Samsung became the first foundry business to announce the initial production of its 3nm process node.
At that time, Samsung’s 3nm yield rate was less than 20 percent and some wafers even had a yield rate of only 10 percent. An industry analyst says, Samsung actually doesn’t know where the fault is.
TSMC says its 3nm process is the most advanced semiconductor technology in both power, performance, and area (PPA). In transistor technology, and a full-node advance from the 5nm generation.
Compared to the 5nm (N5) process, the 3nm process offers up to 1.6X logic density gain and 30-35% power reduction at the same speed and supports the innovative TSMC FINFLEX architecture.
Apple, MediaTek, and Qualcomm:
Still, Apple, MediaTek, Qualcomm, AMD, and Nvidia are the top customer of TSMC and Samsung Foundry business. These clients require various chip nodes throughout the year. While, Apple may still be the first to use a 3nm chipset for next year’s iPhones, followed by Qualcomm and MediaTek.
TSMC announced that it is also preparing for 2nm fabs, which will be upgraded six times than the last node process.
Samsung needs to improve:
TSMC is a long-standing chipset printer and Samsung needs to improve its Foundry business to compete against it. That’s all to suggest for the South Korean company.
HiSilicon Tianguang 800 chipset news is fake: Huawei
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.
The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.
Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.
According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.
In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.
During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.
Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022
Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.
This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.
HiSilicon Tianguang 800 chip:
Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.
On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.
Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.