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Kirin 820: 7nm, 5G, Cortex A76 CPU, Mali-G57 GPU, Da Vinci NPU, Kirin ISP 5.0



Kirin 820 is a 7nm SoC that integrates 5G modem and supports both non-standalone and standalone as well as TDD/FDD full-frequency bands for reliable and stable 5G connectivity.

The Kirin 820 5G equips with Huawei’s self-developed Da Vinci NPU, enhancing AI computing by 73% by 73% at a lower power consumption compared with its predecessor.

The multi-core performance is improved by 27% compared with the previous generation, demonstrating strong performance and energy efficiency. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0 technology, boosts the performance by 38% and energy efficiency by 39%, enabling uninterrupted gaming experiences.

The chipset has Huawei-developed ISP 5.0, which packs block-matching and 3D filtering (BM3D) image noise reduction. As well as the dual-domain video noise reduction technologies for clearer night-time photos.


Kirin 820 Specifications:

  • Process: 7nm
  • CPU: 1 x Cortex-A76 Based@2.36GHz + 3 x Cortex-A76 Based@2.22GHz + 4 x Cortex-A55@1.84GHz
  • GPU: 6-core Mali-G57, Kirin Gaming+ 2.0
  • HUAWEI Da Vinci Architecture, Ascend D110 Lite, HiAI2.0
  • Modem:Modem: 2/3/4/5G, SA&NSA fusion network architecture, FDD&TDD Spectrum Access, DSDS3.x
  • Kirin ISP5.0: BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
  • Memory: LPDDR4X

Kirin 820 Details:

5G SoC:

Kirin 820 is the first mid-range 5G chipset, integrating a 5G modem to provide a cost-effective option. It supports both non-standalone and standalone architectures, as well as TDD/FDD full-frequency bands.

With dual-SIM service concurrency enabled by Kirin 820-powered 5G smartphones, consumers are able to play 5G games on one SIM while making VoLTE HD calls and sending SMS messages on the other SIM.

Kirin 820 optimizes 5G communication experience with features including anti-interference capabilities for complex 5G communication environments, an advanced adaptive receiver for high-speed mobile scenarios, and an ability to intelligently select the optimal channel model for high-speed scenarios.

To reduce latency, the SoC achieves the industry-highest 5G network ratio by comprehensively accelerating 5G network searching and handover, and quicken the time for processing large files and videos.


In addition, Kirin 820 supports bandwidth part (BWP) technology, which implements the switching of bandwidth resources with available 5G bandwidths, reducing 5G power consumption and offering a lasting 5G experience.


This mid-range adopts Huawei’s in-house Da Vinci NPU, enhancing AI computing by 73% at a lower power consumption compared with its predecessor.

Octa-Core CPU and New GPU:


Kirin 820 features an octa-core CPU with one high-performance big core, three balanced middle cores, and four energy-efficient little cores. The big and middle cores are customized based on Cortex-A76 and the little cores are customized based on Cortex-A55.

Achieving an operating rate of up to 2.36 GHz, this combination improves the overall multi-core performance by 27% compared with the previous generation. The Mali-G57 GPU boosts the performance by 38% and energy efficiency by 39% for a faster and smoother gaming experience.

Kirin 820 has Gaming+ 2.0, which incorporates newly updated AI frequency modulation scheduling technology. The technology fuses GPU scheduling into the CPU and DDR system frequency modulation scheduling and adds gaming-associated thread optimization technologies to dynamically detect performance bottlenecks.

Moreover, Kirin Gaming+ 2.0 builds a precise performance and power consumption model by learning over 1 million frames of game images for refinements to performance and power consumption scheduling for each frame and in-depth and precise optimization.


Huawei ISP 5.0:

The Huawei-developed ISP 5.0 supports BM3D for professional-level hardware noise reduction and dual-domain video noise reduction, delivering sharp images and videos even in low light environments.

Most of Deng Li's smartphones are from the Huawei ecosystem and his first Huawei phone was Ascend Mate 2 (4G). As a tech enthusiast, he keeps exploring new technologies and inspects them closely. Apart from the technology world, he takes care of his garden.


Huawei developed low-latency image transmission technology, supporting 8K resolution



Huawei Smart Screen Smart TV 98 inch

Huawei’s chip-making subsidiary, HiSilicon has announced to development of new low-latency image transmission technology to enriches multi-screen devices and enhanced the interactive streams experience.

Although Huawei faces a huge decline of about 88% in 1stQ 2021  but still, it wants to continue the research and development for bringing new technologies in the chip industry.

And now we can see the results of their hard work in the new Huawei HiSilicon image transmission technology to increase the image quality measurements mostly during live broadcasts.

HiSilicon Chips

HiSilicon Image Transmission Technology:

This new technology provides a full stack of solutions for high definition, (HD), ultra high definition (UHD), 4K, and 8K devices. You can see the dried description below-

  • Lower Latency: HiSilicons’ self-developed HiAir ultra-low latency image transmission technology aims to establish a new standard by the next 3 years. it provides a combined benefit of Huawei Cast Plus, automatic device discovery, minimalist connection, and controlled experience.
  • Protocol Deep Optimization: Huawei designed this technology with the Huawei Cast Plus, DLNA, Miracast, and Lelink.
  • Low Memory Design: The image transmission technology uses lesser memory during processing with strong scalability.
  • High Energy Efficiency Ratio: A User only has to connect the TV USB for electricity supply, during the whole process the temperature won’t go over 40 degrees.
  • UHD Image Quality: This new technology will increase the industry’s image quality performance qualification (PQ) standards and provides the most compatible UHD image for media streaming.

Previous News:

In the previous month, HiSilicon opens the recruitments across various locations mainly including Beijing, Shanghai, Shenzhen, etc, for university freshers to provide them an opportunity to jointly develop future technologies. Furthermore, the recruitment categories include Chip, Hardware, Research, Software, Testing, and System.

It’s reported that Huawei wants to keep researching on chipsets and wants to develop its own semiconductor technologies to shrink dependence on other chip manufacturers.

(Via- Ithome)

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SK Hynix begins 1anm DRAM mass production, aims to complete by the second half of 2021



Today, the worldwide semiconductor supplier- SK Hynix officially announced that the company has initiated the mass production of 1anm DRAM-based, 8 Gigabit LPDDR4 mobile chip.

Furthermore, it’s the first time in the history of SK Hynix to work o the EUV (Extreme Ultraviolet) device in mass production. Before, the company used lithography technology for its 1ynm DRAM production.

To date, SK Hynix has been introduced three kinds of 10nm DRAM-based mobile chip generation. Stating with 1x, 1y, 1z, and now the company is bringing 1anm, which is expected to reach the smartphone manufacturers by the second half of 2021.

The company believes that the advantage of  EUV equipment in chip production leads to the increased productivity, and further boosts cost competitiveness. The expected increase is 25% in terms of productivity.


The forthcoming product realizes a 4266Mbp stable transfer rate with 20% of reduced power consumption. Apart from this, the company also plans to implement the 1anm technology to DDR5 device debuted in October 2020 in the coming year.

The Vice-President of the company- Cho Youngmann stated that the 1anm DRAM features the most advanced technology with the reduced investment will serve the company in two aspects. First, it’ll bring high profitability, and secondly, it’ll help the company to position itself as the leading technology.

To be mentioned, LPDDR4 stands for Low Power Double Data Rate, which is the fourth generation of the 10nm process technology. This chip is specially designed for smartphone devices.

About SK Hynix:

The SK Hynix is a well-known South Korean firm that works on the manufacture and sales of semiconductor devices. It’s a worldwide provider of mobile chips, which mainly includes Dynamic Random Access Memory chips (DRAM), flash memory chips (NAND Flash), and CMOS Image Sensors (CIS).


(Via- SKhynix)

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Huawei plans new chip manufacturing technology, aims lesser chirp frequency

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Breaking: Huawei will start manufacturing its own chipset in 2022, HiSilicon Factory is preparing




Huawei Kirin

It’s been circulating for quite a time that Huawei is preparing to build its own chipsets and now, the latest report on this matter shown us the sign of this possibility.

Digitimes reports that Huawei will build its first wafer fabrication manufacturing company in Wuhan, Hubei  Province. According to the information, the company is expected to start production in stages from next year.

From the first perspective, this is a piece of big news and Huawei’s preparation to enter the chip-making industry is a big topic of discussion. On the other hand, HiSilicon, Huawei’s chip designing subsidiary have the capability to design advanced chip designs.


Sources reveal that this factory initially used to produce optical communication chips and modules to gain self-sufficiency and keep a good quantity of required chipsets.

Huawei is best known for its telecom equipment dominance and the company sells different types of services and consumer products both commercial and for the industry partners.

Huawei Hisillicon Factory in Wuhan:

Currently, Huawei’s Wuhan-based Research Institute has nearly 10,0000 research and development personnel that mainly researching and developing optical communication equipment, HiSilicon chips, and automotive laser radars.

Some media have stated that HiSilicon is the only company in China that has the ability to develop a coherent optical DSP chipset.


It’s reported that the establishment of Huawei HiSilicon’s plant in Wuhan already began to take shape in early 2019. During that time, a project named “HiSilicon Factory” became a hot topic of discussion.

The news of the HiSilcon fab factory broke out from the issues that occurred after the issue in Huawei’s bond in China. In 2019, it’s reported that Huawei intended to register a medium-term note scale of 20 billion yuan, and the first phase of the proposed issuance is about 3 billion yuan, with a term of 3 years. The raised funds will be used To supplement the working capital of the company’s headquarters and its subsidiaries.

In the proposed plan, Huawei proposed the Wuhan HiSilicon factory project with a total of 1.8 billion yuan investment. Related to this, the website of Wuhan Municipal Bureau of Natural Resource and planning also published a “Huawei Technology Co., Ltd. Huawei Wuhan R&D and Production Project (Phase II) A Plot Planning and Design Plan Adjustment Pre-approval Announcement”.

At that time, this project was first mentioned as a HiSilicon factory but later the news was disappeared from the discussion.


Beginning and the next challenge:

For now, there’s no official information that has been confirmed on this subject but we’ll have to wait to get more insights on this developing story.

However, we can say that Huawei’s new semiconductor adventure should get boosted, as it requires more research to develop advanced chipsets. Also, we definitely want to see the Chinese tech company to develop its own chipset for smartphones and other IoT devices.

But at the moment, we can anticipate and joy on this piece of news.

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HiSilicon wants to develop best chips and will not lay off employees even if cannot make new chipsets: Huawei Semiconductor Division

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