On March 30, Honor launched Honor 30S equipped with the latest Kirin processor – Kirin 820 with 5G connectivity.
This new 5G mid-range chipset is the successor of last year’s Kirin 810 and comes with majorly improved performance over its predecessor.
The Kirin 820 is built with 7nm process technology and uses Huawei’s self-developed NPU architecture, improving software efficiency and accelerating AI performance.
The Kirin 820 consists of 1 x Cortex-A76 (2.3 6GHz) + 3 x Cortex-A76 (2.22GHz) + 4 x Cortex-A55 (1.84GHz) combination on the CPU level for better performance. The chipset includes 6 core of Mali-G57 GPU, NPU, Kirin ISP 5.0 and a modem that supports 2/3/4/5G networks.
According to the information, the Kirin 820 CPU multi-score performance is improved up to 27%, GPU Performance improved up to 38%, and AI NPU performance is improved a whopping 73% over its predecessor Kirin 810.
Moreover, the new Kirin ISP 5.0 improves photo noise and exposure reduction by up to 30%, 20% improvements in video noise reduction, 15% improvement in ISP throughput and 15% improvement in energy efficiency.
SK Hynix begins 1anm DRAM mass production, aims to complete by the second half of 2021
Furthermore, it’s the first time in the history of SK Hynix to work o the EUV (Extreme Ultraviolet) device in mass production. Before, the company used lithography technology for its 1ynm DRAM production.
To date, SK Hynix has been introduced three kinds of 10nm DRAM-based mobile chip generation. Stating with 1x, 1y, 1z, and now the company is bringing 1anm, which is expected to reach the smartphone manufacturers by the second half of 2021.
The company believes that the advantage of EUV equipment in chip production leads to the increased productivity, and further boosts cost competitiveness. The expected increase is 25% in terms of productivity.
The forthcoming product realizes a 4266Mbp stable transfer rate with 20% of reduced power consumption. Apart from this, the company also plans to implement the 1anm technology to DDR5 device debuted in October 2020 in the coming year.
The Vice-President of the company- Cho Youngmann stated that the 1anm DRAM features the most advanced technology with the reduced investment will serve the company in two aspects. First, it’ll bring high profitability, and secondly, it’ll help the company to position itself as the leading technology.
To be mentioned, LPDDR4 stands for Low Power Double Data Rate, which is the fourth generation of the 10nm process technology. This chip is specially designed for smartphone devices.
About SK Hynix:
The SK Hynix is a well-known South Korean firm that works on the manufacture and sales of semiconductor devices. It’s a worldwide provider of mobile chips, which mainly includes Dynamic Random Access Memory chips (DRAM), flash memory chips (NAND Flash), and CMOS Image Sensors (CIS).
Breaking: Huawei will start manufacturing its own chipset in 2022, HiSilicon Factory is preparing
Digitimes reports that Huawei will build its first wafer fabrication manufacturing company in Wuhan, Hubei Province. According to the information, the company is expected to start production in stages from next year.
From the first perspective, this is a piece of big news and Huawei’s preparation to enter the chip-making industry is a big topic of discussion. On the other hand, HiSilicon, Huawei’s chip designing subsidiary have the capability to design advanced chip designs.
Sources reveal that this factory initially used to produce optical communication chips and modules to gain self-sufficiency and keep a good quantity of required chipsets.
Huawei is best known for its telecom equipment dominance and the company sells different types of services and consumer products both commercial and for the industry partners.
Huawei Hisillicon Factory in Wuhan:
Currently, Huawei’s Wuhan-based Research Institute has nearly 10,0000 research and development personnel that mainly researching and developing optical communication equipment, HiSilicon chips, and automotive laser radars.
Some media have stated that HiSilicon is the only company in China that has the ability to develop a coherent optical DSP chipset.
It’s reported that the establishment of Huawei HiSilicon’s plant in Wuhan already began to take shape in early 2019. During that time, a project named “HiSilicon Factory” became a hot topic of discussion.
The news of the HiSilcon fab factory broke out from the issues that occurred after the issue in Huawei’s bond in China. In 2019, it’s reported that Huawei intended to register a medium-term note scale of 20 billion yuan, and the first phase of the proposed issuance is about 3 billion yuan, with a term of 3 years. The raised funds will be used To supplement the working capital of the company’s headquarters and its subsidiaries.
In the proposed plan, Huawei proposed the Wuhan HiSilicon factory project with a total of 1.8 billion yuan investment. Related to this, the website of Wuhan Municipal Bureau of Natural Resource and planning also published a “Huawei Technology Co., Ltd. Huawei Wuhan R&D and Production Project (Phase II) A Plot Planning and Design Plan Adjustment Pre-approval Announcement”.
At that time, this project was first mentioned as a HiSilicon factory but later the news was disappeared from the discussion.
Beginning and the next challenge:
For now, there’s no official information that has been confirmed on this subject but we’ll have to wait to get more insights on this developing story.
However, we can say that Huawei’s new semiconductor adventure should get boosted, as it requires more research to develop advanced chipsets. Also, we definitely want to see the Chinese tech company to develop its own chipset for smartphones and other IoT devices.
But at the moment, we can anticipate and joy on this piece of news.
Global semiconductor sales increase by 3.6% in first quarter of 2021: SIA
Recently, Semiconductor Industry Association (SIA) has released the worldwide sales report of semiconductors during the first quarter of 2021. The total sales are accounted for 123.1 billion USD with an increase of 3.6% and 17.8% from last year.
Regrading this, SIA said the sales came to 41 billion USD in March and rises 3.7% in the month. In terms of regional sales, Europe sales increased by 5.8%, China 5.3%, Asia Pacific and other 3.4%, Japan 3.1%, and Americans 0.6% in Q1 of 2021.
On the annual basis, sales also grew across all markets consists of China accounted for 25.6%, the Asia Pacific and other recorded 19.6%, Japan 13%, and Americans 9.2%. and Europe 8.7%.
The report shows that global semiconductor sales in the Q1 of 2021 remain sturdy and improving sales from the previous quarter.
“Global semiconductor sales remained strong during the first quarter of 2021, topping sales from the previous quarter and substantially outpacing the total from the first quarter of last year,” said John Neuffer, SIA president and CEO.
“Year-to-year and month-to-month sales in March increased across all major regional markets, and demand grew across a range of product categories,” he added