Kirin 985 is built with the TSMC 7nm technology process, integrated with 5G Modem, supports NSA/SA dual architectures, and TDD/FDD full spectrum bands.
Kirin 985 Specifications:
- Process: 7nm
- CPU: 1 x Cortex-A76 Based@2.58GHz + 3 x Cortex-A76 Based@2.40GHz + 4 x Cortex-A55@1.84GHz
- GPU: 8-core Mali-G77, Kirin Gaming+ 2.0
- Huawei Da Vinci Architecture, 1 x Ascend D110 Lite + 1 x Ascend D100 Tiny, HiAI2.0
- Modem:Modem: 2/3/4/5G, SA&NSA fusion network architecture, FDD&TDD Spectrum Access, DSDS3.x
- Kirin ISP5.0: BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
- Memory: LPDDR4X
Kirin 985 Details:
Kirin 985 achieves leading 5G speed and supports NSA and SA architecture and TDD/FDD full spectrum bands. It also supports service concurrency for dual cards on 5G phones. Users can play games using one 5G mobile data over one SIM card, while still using the other SIM to receive VoLTE HD voice calls and handle messaging at the same time.
To provide seamlessly 5G experiences, the Kirin 895 5G comes with anti-jamming capabilities for complex 5G communication environments, the advanced adaptive receiver based on machine learning for high-speed mobile scenarios.
To reduce latency, Kirin 985 accelerates 5G network searching and handover. Achieving the best 5G occupation ratio to ensure ultra-low latency.
In addition, Kirin 985 supports bandwidth part (BWP) technology, which implements the flexible switching of bandwidth resources with available 5G bandwidths. Reducing 5G power consumption and offering a lasting 5G experience.
Kirin 985 adopts Da Vinci NPU architecture, improving AI performance by 173% compared to the predecessor.
The AI power of Kirin 985 improves photographs by providing smarter AI shooting, solves common issues. The new AI RAW technology significantly improves image quality. It enriches image detail while reducing noise, and boosts the image’s dynamic range performance.
Based on the AI portrait segmentation capability, Kirin 985 effectively removes image distortions at the edges of group photos and performs real-time AI correction on the edges of images to achieve the desired effects.
Kirin ISP 5.0:
The Huawei-developed Kirin ISP 5.0 improves both pixel throughput and energy efficiency by 15% over the previous generation. In addition to the AI RAW technology, Kirin ISP 5.0 supports BM3D for image noise reduction and dual-domain video noise reduction. This improves noise reduction performance for images and videos by 30% and 20%, respectively.
CPU and GPU:
Kirin 985 has a new CPU architecture including one big core (Cortex-A76 Based), three middle cores (Cortex-A76 Based), and four little cores (Cortex-A55). This combination achieves optimum performance and higher energy efficiency.
For the first-ever, Huawei has used a new 8-core Mali-G77 GPU in its chipset starting Kirin 985. The new GPU greatly improves performance and energy efficiency and allows for a faster and smoother gaming experience.
To help achieve this, Kirin 985 supports Kirin Gaming+ 2.0, which uses the newly updated AI frequency modulation scheduling technology.
The technology fuses GPU scheduling into the CPU and DDR system frequency modulation scheduling and adds gaming-associated thread optimization technologies to dynamically detect performance bottlenecks.
Moreover, Kirin Gaming+ 2.0 builds a precise performance and power consumption model by learning from over 1 million frames of game images, refining performance and power consumption scheduling for each frame, and achieving in-depth and precise optimization.
HiSilicon Tianguang 800 chipset news is fake: Huawei
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.
The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.
Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.
According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.
In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.
During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.
Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022
Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.
This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.
HiSilicon Tianguang 800 chip:
Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.
On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.
Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.
Huawei and SMIC fab manufacturing news is a rumor: Industry Insider
Recently, some industry insiders confirmed that it is a rumor that Huawei and SMIC will build a wafer fab manufacturing company in China. Just a few days ago, it was reported that Huawei with the help of SMIC develop fab with around ten billion dollars investment.
In addition to this, a report also mentioned at the industry exhibition in Taiwan, the relevant personnel of Huawei and TSMC’s supply chain partners was spotted discussing the equipment purchase for the factory. It is disclosed that SMIC Southern and local government funding and other details.
Regarding this, a person familiar with this matter from Huawei told Chinese media that above the news was false. Meanwhile, several people close to SMIC also mentioned that SMIC never participated in this and assisted Huawei in building any factories.
However, the cooperation between the two parties was a legal and regulatory business activity only at the foundry level, not external, conceived the development of “grouping and warming”.
SMIC and Huawei:
SMIC is the largest wafer fab and contract chip maker in mainland China. To restrict these firms, the US government listed them on the “entity list” and targeted sanctions policies are increasingly being implemented. Since then, Huawei is facing a shortage of core components and finding solutions to overcome them.
So far, Huawei and its allies have been banned from all U.S, which prohibits the companies from purchasing goods made with the country’s manufacturer or supported technologies.
Therefore, SMIC must be licensed to import required components. It is also necessary to apply to the Department of Commerce for advanced technology nodes (10 nanometers or less), direct export of essential goods required for the production of semiconductors will be restricted.
China’s independent supply chain system is still difficult to meet the requirements of Huawei and SMIC. Therefore, the two companies’ operations still need to be enforced in the United States to import certain key products, materials, and equipment.
So, a person familiar with the matter pointed out that, in fact, SMIC and Huawei have maintained long-term and effective communications with the US Department of Commerce, and the two companies have never thought of working behind closed doors.
Even under extreme pressure, Huawei founder Ren Zhengfei has repeatedly stated publicly that Huawei will be more determined to cooperate with US companies and maintain an open attitude. SMIC co-CEO Zhao Haijun once explicitly stated in a financial report briefing that SMIC has maintained a stable cooperative relationship with US suppliers for the past 20 years. Therefore, a large number of US suppliers are the first choice of SMIC.
After getting banned, SMIC and suppliers actively applied for permits for the first time, and the supplier is also updating the progress of permit applications by fab makers. On another level, Huawei and SMIC are among the few domestic semiconductor companies that insist on taking an international route to serve customers around the world.
Among them, SMIC not only helps in the development of domestic design companies but also provides support for the local production of many major international companies. At the same time, in recent years, SMIC, including Beijing, Shanghai, Shenzhen, and many other places, has launched new capacity projects focusing on 28 nanometers and above, and it is impossible for the customer to stop its progress.
If both sides try to break the technical blockade of the United States through cooperation in building factories, this could lead to further sanctions in the United States. Therefore, it is advisable to adopt this method to jeopardize the security of both parties in the operation of the company.