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Kirin 985: 7nm, 5G, Cortex A76 CPU, Mali-G77 GPU, Da Vinci NPU, Kirin ISP 5.0



Kirin 985 is built with the TSMC 7nm technology process, integrated with 5G Modem, supports NSA/SA dual architectures, and TDD/FDD full spectrum bands.

Kirin 985 Specifications:

  • Process: 7nm
  • CPU: 1 x Cortex-A76 Based@2.58GHz + 3 x Cortex-A76 Based@2.40GHz + 4 x Cortex-A55@1.84GHz
  • GPU: 8-core Mali-G77, Kirin Gaming+ 2.0
  • Huawei Da Vinci Architecture, 1 x Ascend D110 Lite + 1 x Ascend D100 Tiny, HiAI2.0
  • Modem:Modem: 2/3/4/5G, SA&NSA fusion network architecture, FDD&TDD Spectrum Access, DSDS3.x
  • Kirin ISP5.0: BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
  • Memory: LPDDR4X

Kirin 985 Details:

5G SoC:

Kirin 985 achieves leading 5G speed and supports NSA and SA architecture and TDD/FDD full spectrum bands. It also supports service concurrency for dual cards on 5G phones. Users can play games using one 5G mobile data over one SIM card, while still using the other SIM to receive VoLTE HD voice calls and handle messaging at the same time.

To provide seamlessly 5G experiences, the Kirin 895 5G comes with anti-jamming capabilities for complex 5G communication environments, the advanced adaptive receiver based on machine learning for high-speed mobile scenarios.

To reduce latency, Kirin 985 accelerates 5G network searching and handover. Achieving the best 5G occupation ratio to ensure ultra-low latency.


In addition, Kirin 985 supports bandwidth part (BWP) technology, which implements the flexible switching of bandwidth resources with available 5G bandwidths. Reducing 5G power consumption and offering a lasting 5G experience.


Kirin 985 adopts Da Vinci NPU architecture, improving AI performance by 173% compared to the predecessor.

The AI power of Kirin 985 improves photographs by providing smarter AI shooting, solves common issues.  The new AI RAW technology significantly improves image quality. It enriches image detail while reducing noise, and boosts the image’s dynamic range performance.


Based on the AI portrait segmentation capability, Kirin 985 effectively removes image distortions at the edges of group photos and performs real-time AI correction on the edges of images to achieve the desired effects.

Kirin ISP 5.0:

The Huawei-developed Kirin ISP 5.0 improves both pixel throughput and energy efficiency by 15% over the previous generation. In addition to the AI RAW technology, Kirin ISP 5.0 supports BM3D for image noise reduction and dual-domain video noise reduction. This improves noise reduction performance for images and videos by 30% and 20%, respectively.

CPU and GPU:


Kirin 985 has a new CPU architecture including one big core (Cortex-A76 Based), three middle cores (Cortex-A76 Based), and four little cores (Cortex-A55). This combination achieves optimum performance and higher energy efficiency.

For the first-ever, Huawei has used a new 8-core Mali-G77 GPU in its chipset starting Kirin 985.  The new GPU greatly improves performance and energy efficiency and allows for a faster and smoother gaming experience.

To help achieve this, Kirin 985 supports Kirin Gaming+ 2.0, which uses the newly updated AI frequency modulation scheduling technology.

The technology fuses GPU scheduling into the CPU and DDR system frequency modulation scheduling and adds gaming-associated thread optimization technologies to dynamically detect performance bottlenecks.


Moreover, Kirin Gaming+ 2.0 builds a precise performance and power consumption model by learning from over 1 million frames of game images, refining performance and power consumption scheduling for each frame, and achieving in-depth and precise optimization.

Yash is a graduate of computer science and followed his way into journalism, he is interested in various subjects related to technologies and politics. Yash likes to listen classical songs and has a huge library of classical mixes.


Chipmakers TSMC and UMC continue to rise: Report




Top chipmakers, TSMC (Taiwan Semiconductor Manufacturing Company) and UMC (United Microelectronics Corporation) making the semiconductor industry continue to rise in Q4, say a report. The wafer duo of TSMC (2330) and UMC increased by 10%, up to 20% respectively.

Moving ahead, the power management and driver ICs are still soaring with a possibility of price increase for some products. However, the power management ICs may be out of stock all the way until the second half of next year.

Ups and Downs in Production Capacity:

According to the report, TSMC and UMC’s production capacity will remain tight for this season as well. Besides, a previous report on this matter reveals that TSMC cloud increase price corresponding to the market and customers.

In this line, the new price list has been activated since August for some customers meanwhile some of them will start from October. This new adjustment results in a 15-20 % increment in the mature process and 10% in the advanced process.


Moving to the UMC, this company also preparing for an increase before the end of the fourth quarter. The new regulation will have an average increase of 10% since November simultaneously increasing some processes by 15%.  With the help of price increases in the semiconductor industry,  the market analyzers forecast that TSMC and UMC’s revenue, gross profit margin, and net profit after tax will continue to rise.

 IC Chips and Design:

The report further reveals that the Taiwanese chip boundaries are rising chip foundries and launching countermeasures. Furthermore, the chip price increase from anonymous IC design firms in the first half has been shown on the packaging and testing of the products.


In addition, July, August, September to November, and December are also expected to keep the same flow. If the customers want express delivery, they have can only adjust prices for the moment. Besides, the makers also are in negotiation with customers.

For instants, TSMC has increased by 20% while the other manufactures are still considering the price increase strategy. The dilemma is to whether to only increase the price for TSMC invested product of all products coming next.



This reports revelers around the power management IC factories in Taiwan alongside Silicon Power, Mota, Zhixin, Analogue, Tongjia, and Hongguan Electronics from China. The foundries are out of print for the power management chips. At the starting of this year, the customers were rushing for almost every item but now they are only demanding some specific parts.

Besides, Novatek and Tianyu are still ruling the driver IC market. And the present conditions aren’t favorable in the TV market so makers are reducing the price. Still, the driver IC inventory occupies small marketing, so that the price increase is acceptable for the customers.

Adding to this, driver chips such as power management ICs are mostly produced by 8-inch factories. However, their production capacity is tight currently. Thus, only some driver IC quotations are likely to be increase prices at present.

(Via- Ithome)

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Huawei developed low-latency image transmission technology, supporting 8K resolution



Huawei Smart Screen Smart TV 98 inch

Huawei’s chip-making subsidiary, HiSilicon has announced to development of new low-latency image transmission technology to enriches multi-screen devices and enhanced the interactive streams experience.

Although Huawei faces a huge decline of about 88% in 1stQ 2021  but still, it wants to continue the research and development for bringing new technologies in the chip industry.

And now we can see the results of their hard work in the new Huawei HiSilicon image transmission technology to increase the image quality measurements mostly during live broadcasts.

HiSilicon Chips

HiSilicon Image Transmission Technology:

This new technology provides a full stack of solutions for high definition, (HD), ultra high definition (UHD), 4K, and 8K devices. You can see the dried description below-

  • Lower Latency: HiSilicons’ self-developed HiAir ultra-low latency image transmission technology aims to establish a new standard by the next 3 years. it provides a combined benefit of Huawei Cast Plus, automatic device discovery, minimalist connection, and controlled experience.
  • Protocol Deep Optimization: Huawei designed this technology with the Huawei Cast Plus, DLNA, Miracast, and Lelink.
  • Low Memory Design: The image transmission technology uses lesser memory during processing with strong scalability.
  • High Energy Efficiency Ratio: A User only has to connect the TV USB for electricity supply, during the whole process the temperature won’t go over 40 degrees.
  • UHD Image Quality: This new technology will increase the industry’s image quality performance qualification (PQ) standards and provides the most compatible UHD image for media streaming.

Previous News:

In the previous month, HiSilicon opens the recruitments across various locations mainly including Beijing, Shanghai, Shenzhen, etc, for university freshers to provide them an opportunity to jointly develop future technologies. Furthermore, the recruitment categories include Chip, Hardware, Research, Software, Testing, and System.

It’s reported that Huawei wants to keep researching on chipsets and wants to develop its own semiconductor technologies to shrink dependence on other chip manufacturers.

(Via- Ithome)

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SK Hynix begins 1anm DRAM mass production, aims to complete by the second half of 2021



Today, the worldwide semiconductor supplier- SK Hynix officially announced that the company has initiated the mass production of 1anm DRAM-based, 8 Gigabit LPDDR4 mobile chip.

Furthermore, it’s the first time in the history of SK Hynix to work o the EUV (Extreme Ultraviolet) device in mass production. Before, the company used lithography technology for its 1ynm DRAM production.

To date, SK Hynix has been introduced three kinds of 10nm DRAM-based mobile chip generation. Stating with 1x, 1y, 1z, and now the company is bringing 1anm, which is expected to reach the smartphone manufacturers by the second half of 2021.

The company believes that the advantage of  EUV equipment in chip production leads to the increased productivity, and further boosts cost competitiveness. The expected increase is 25% in terms of productivity.


The forthcoming product realizes a 4266Mbp stable transfer rate with 20% of reduced power consumption. Apart from this, the company also plans to implement the 1anm technology to DDR5 device debuted in October 2020 in the coming year.

The Vice-President of the company- Cho Youngmann stated that the 1anm DRAM features the most advanced technology with the reduced investment will serve the company in two aspects. First, it’ll bring high profitability, and secondly, it’ll help the company to position itself as the leading technology.

To be mentioned, LPDDR4 stands for Low Power Double Data Rate, which is the fourth generation of the 10nm process technology. This chip is specially designed for smartphone devices.

About SK Hynix:

The SK Hynix is a well-known South Korean firm that works on the manufacture and sales of semiconductor devices. It’s a worldwide provider of mobile chips, which mainly includes Dynamic Random Access Memory chips (DRAM), flash memory chips (NAND Flash), and CMOS Image Sensors (CIS).


(Via- SKhynix)

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Huawei plans new chip manufacturing technology, aims lesser chirp frequency

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