On July 12, 2019, Huawei has applied for a new patent related to technology that uses artificial intelligence to control the heat dissipation of smart cars. Recently, a Weibo tipster disclosed that the company has published this patent with publication number CN112602036A.
The patent documents describe that the technology that reduces the volume of computing devices and improves the heat wearing capacity. A heat sink (10, 70) arranged between the two main boards (40, 50) and dissipating heat for the two main boards (40, 50).
On the side of each motherboard (40, 50) away from the radiator and connected to the radiator (10, 70), there is no version. Among them, each closed group version (20, 30) and the radiator (10, 70) will correspond to the motherboard (40.50) is sealed between the closed plate and the radiator (10, 70).
So as to realize that the vehicle-mounted computing device that contains two motherboards (40, 50) can draw a shared radiator (R, 70). Heat reduces the volume of computing devices in smart cars and improves the ability of computing devices in smart cars to wear heat.
On the other hand, Huawei is continuously launching new products and new technologies in the AI intelligence field and is also making rapid progress securing its innovation under patents. Currently, the field of artificial intelligence is a battleground for global powers.
Aside from this, Huawei has recently published a patent design, Intelligent Robot, which can be used to interact with the driver from opening the door to getting off the car and leaving.