Earlier today, we saw that TSMC has begun mass producing new 7nm EUV processed Kirin chip and now a latest reported that HiSilicon, Huawei’s chip-making subsidiary is expected to bring a new processor in tomorrow’s meeting in China.
On May 28, a person related to Huawei told us that he has received an invitation from HiSilicon, where the company will conduct a corresponding communication meeting on May 29 and a new Kirin processor may be unveiled during the meeting but not the flagship CPU.
He also said, from the perspective of the industry supply chain, this time HiSilicon may be showing the details of the Kirin 720 and this new processor can be later released as a successor of Kirin 710 (released last year) to be featured inside the budget segment devices.
The latest information about this processor reveals that the Kirin 720 will use TSMC’s 10nm process and will also feature upgraded GPU and NPU units.
Although this is all we could get from the informer but the company is yet to confirm anything on this matter. Also, we’ll wait for tomorrow to see what the company really brings from its gadget bag.