TSMC recently appeared in the 2022 North America Technology Symposium where it defined the upcoming N2 process and FINFLEX Technology. These futuristic innovations are based on logistics, specialty, and 3D IC technologies.
2022 North America Technology Symposium planned to bring on an in-person event showcasing multiple technologies and innovations across the world. Apart from the other subjects, the Symposium also highlighted the leading-edge 2nm (N2) process and FINFLEX Technology of the TSMC.
TSMC thought’s on innovations
The CEO of TSMC, Dr. C.C. Wei described how these innovations will open new doors to transformation and growth.
TSMC FINFLEX for N3 and N3E – TSMC’s industry-leading N3 technology, set to enter volume production later in 2022, will feature the revolutionary TSMC FINFLEX™ architectural innovation offering unparalleled flexibility for designers.
The TSMC FINFLEX innovation offers choices of different standard cells with a 3-2 fin configuration for ultra-performance, a 2-1 fin configuration for best power efficiency and transistor density, and a 2-2 fin configuration providing a balance between the two for Efficient Performance.
With TSMC FINFLEX architecture, customers can create system-on-chip designs precisely tuned for their needs with functional blocks implementing the best-optimized fin configuration for the desired performance, power, and area target, and integrated on the same chip. For more information on FINFLEX, please visit N3.TSMC.COM.
“We are living in a rapidly changing, supercharged, digital world where demand for computational power and energy efficiency is growing faster than ever before, creating unprecedented opportunities and challenges for the semiconductor industry.”
Here is detailed info about the respective innovations:
N2 Technology –
According to the information, the TSMC 2nm process will equip the nanosheet transistor framework. As a result, it will provide a full-node improvement in power efficiency and performance. Further, it will deliver a 10-15% speed rate at the same power.
The N2 process also gives space to high-performance components. With a comprehensive chipset and integrating solutions, the company will begin manufacturing this tech in 2025.
TSMC FINFLEX Technology
Consequently, this technology is entirely based on designers. It will offer unparalleled flexibility and various standard cells with a 3-2 fin configuration for the extreme level of performance. So far, these configuration includes the 2-1 fin for better power efficiency and the 2-2 fin for maintaining a balance between efficient performance.
The unique technology will enable the customers to innovate system-on-chip layouts. Moreover, they can tune it and implement better optimizes, power, targets, and fin configuration accordingly.
Ideas of Expanding the Ultra-Low Power platform and TSMC 3D Fabric also took place in the Symposium. You can read more about these innovations HERE.
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Huawei begins Third-Gen 5G Massive MIMO deployment in global markets, starting from Philippines
Huawei has decided to commercially deploy the third-generation 5G Massive MIMO in the global markets. And, to begin with, the company has initiated the assembling procedure of the product from the Philippines region.
According to the latest information, the Huawei 5G Massive MIMO is capable of achieving the best performance with the lowest power consumption. Further, it involves several advanced and new-generation innovative technologies for managing operations.
For instance, ultra-wideband, multi-antenna, and extremely large antennas. Together, these components improve spectral as well as energy efficiency. Besides, it also aids the industrialists to maintain green, simplified and high-end 5G networks.
So far, the Philippines has been constructing the 5G infrastructure for three years. On the flip side, it executed several Massive MIMO products to continuously deliver 5G facilities among users as well as maintain the 4G demands.
However, in the recent few years, the 5G techniques have overtaken the network spectrum. And the latest MIMO product can face all the hurdles to meet the required network development. The proof is the download and upload speeds which are 35% more than the normal network solutions.
Moreover, it enlarges the coverage area of the network by 30 percent. Eventually, it surrounds the large inter-site distances that other technologies usually don’t.
5G Massive MIMO – a step towards sustainable development!
The President of Huawei’s Wireless Solution – Yang Chaobin gives the following details of the third-generation 5G Massive MIMO product:
“Ultra-wideband, multi-antenna, and extremely large antenna arrays are important innovations for improving coverage and reducing energy consumption. We believe that continuously improving the utilization of air interface resources will be conducive to the sustainable development of the communications industry in the Philippines.”
Huawei has begun its work in the respective network field and will keep adding unique and thoughtful techniques. Consequently, we will soon be able to see new and high-tech network benefits in every corner of the world.
Huawei proposed FRMCS solution to promote Digital transformation in Railways
Huawei has introduced the Future Railway Mobile Communication System (FRMCS) digital solution in Berlin. Ultimately, this solution is the result of great research and hard work of the Chinese tech giant in the railway industry for more than two decades.
The Chinese manufacturer launched the FRMCS digital solution at the 9th Huawei Global Rail Summit in Berlin, Germany. Thousands of committee members and reputed officials of the company attended the event to see the dynamic debut of the respective solution.
Thoughts like what is this solution and how is it beneficial would be running in your minds. Let’s simply understand this. Over the past few years, the demand for smart and intelligent railway mechanisms has touched new heights.
Individuals are expecting transformed and improved railway operations that ensure better safety and advanced services. Consequently, the Huawei FRMCS solution is a vital technology that will fulfill all the requirements, needed in the current scenario.
It not only offers high reliability and low latency for managing the train but also brings new services to the ground. For instance, locomotive status monitoring, train operation monitoring, visualized dispatch of O&M personnel, improving fault prediction accuracy, O&M efficiency, and more.
Huawei FRMCS Solution
The new solution relies upon the 8T8R Smart MIMO technology that enables the coverage of 1900MHz. On the other hand, it works for three crucial factors: network elements, reliable services, and interconnection mediums. Thus, with this solution, the railway sectors would be able to bring durable communication conditions.
The President of Huawei Enterprises Wireless Domain delivered a short speech on how this solution will add more digitization:
“The railway industry is now in a critical period of digital transformation. When the requirements for train-to-ground wireless communication systems are already higher than ever before. Huawei FRMCS can meet these requirements by integrating Huawei’s 4G and 5G technologies. It can help railway customers build high-reliability, high-bandwidth, future-oriented train-to-ground wireless broadband networks that are safe, reliable, converged, simplified, and capable of long-term evolution.”
To summarize, the FRMCS solution will be a huge aid in the wireless digital foundation of smart railways.
Huawei Kirin reaches new low due stopped chipset production
According to the latest report coming from Counterpoint Research, Huawei’s Kirin chipset maker subsidiary has now hit record low shares in the global mobile chipset market.
American chipset maker – MediaTek has topped the list with 39 percent of the market share. The chipset maker has used the power of its low-mid range chipset that helped the company to gather new shares in the mobile application processor segment.
Meanwhile, Qualcomm comes with 29 percent of the market share and maintained its position in the premium chipset segment. But there’s a flip side, due to the sale of high-end chipsets, Qualcomm has achieved a 44 percent share in terms of AP shipment revenue in Q2 2022.
The baseband chipset support for Qualcomm has been boasted by iPhone 14 series, as Apple intends to further get the new network chipset from the company.
HiSilicon has been known for the shipment of Kirin chipsets and they were largely used in Huawei devices only. With the implication of the new U.S. ban, the company has been banned from accessing new chipset printing permission via Taiwan Semiconductor Manufacturing Company (TSMC).
The chipset was printed via TSMC was Kirin 9000 with a 5nm process. After the ban, Huawei stockpiled Kirin 9000 chips and used them on several phones but the chipset inventory has been running out and the Chinese tech maker has already started using Qualcomm’s processors for all of the smartphone releases.
So, you can expect that the record low is the result of the past scenarios that happen with Huawei and caused Kirin chipset production in a negative manner.