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Rumor: Kirin 820 to built on TSMC’s 6nm process and 5G, could be introduced in next Nova smartphones?

With the launch of Huawei Nova 5 smartphones, Huawei unveiled the Kirin 810 processor built with TSMC’s 7 nanometer (7 nm) process and a new rumor on this subject hints that the company may introduce a new chipset of the Kirin 800 series with 6nm process and 5G baseband.

Kirin 810 is built on Huawei’s in-house Da Vinci architecture with improved performance, AI energy efficiency, photography, and communications.

Kirin 810 Specifications:

  • Process: 7nm
  • CPU: 2×A76 2.27GHz+6×A55 1.88GHz
  • GPU: Mali G52
  • NPU: Ascend D100 Lite
  • Modem: LTE Cat.12/13 UL
  • Dual SIM Dual VoLTE
  • ISP: Kirin ISP4.0
  • Memory: LPDDR4X@2133MHz

According to TSMC, the 6-nanometer (N6) process provides an upgraded version of 7nm technology and leverages the same extreme ultraviolet (EUV) lithography of the 7N+ technology to deliver 18% higher logic density over 7nm process.

It’s also expected that Huawei could upgrade CPU to A77 architecture but there isn’t any progress to be made in the GPU section. Also, we’d like to know whether Huawei gonna obtain a new license from ARM to access its latest CPU cores.

To be mentioned, 2020 will be the year of 5G smartphones, where the Kirin 990 5G and Kirin 1000 (to be built on 5nm) will take on high-end flagships. On the other hand, Kirin 820 likely to become a key solution for cheap 5G devices.

It’s still not confirmed whether we’ll see this chipset or any new chipset from the Kirin 800 series any time soon but if the company is planning to do something similar than we expect next Nova smartphones to be the first recipient.

TSMC has scheduled to start trial production of 6nm chips in the first quarter of 2020 and the mass production likely to begin in 2021. However, the mass production may move to the second half of this year on higher customer demand.

Also, Check:

[Finally] Huawei Mate X officially launched, will also launch Mate Xs with Kirin 990

Kirin A1: The world’s first Bluetooth 5.1 and Bluetooth Low Energy 5.1 Wearable Chip

 



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