Connect with us

Semiconductor

Kirin 820 5G officially confirmed to launch with Honor 30S

Published

on


Today, Honor has officially confirmed the identity of its next 5G Kirin chipset as Kirin 820. It will be equipped inside the Honor 30S 5G smartphone, scheduled to launch on March 30 in China.

Currently, Honor didn’t reveal any specifics of this chip but recent exposure of information says that the Kirin 820 will be based on a 7nm manufacturing process, A76 CPU and Mali G77 GPU.

The SoC also has improved ISP and Neural Processing Unit (NPU) featuring AI cores from the in-house Ascend lite and supported by the Da Vinci architecture.

Below you check what Honor has to say about this upcoming 5G mid-range chipset. (Translated)

Advertisement

5G anti-interference ability:

The actual communication environment is full of various interference signals, especially in dense areas, which are extremely complicated. Users will be affected by interference signals during the use of mobile phones. Good 5G mobile phones are based on leading interference signal suppression technologies to reduce the impact of interference and bring stable and high-speed business experience to users.

5G energy efficiency:

Consume less power and transmit more data, which is directly related to user experience. Excellent 5G mobile phones can achieve better energy efficiency ratios and can achieve better energy efficiency ratios through AI intelligent scheduling algorithms according to business needs (data transmission heavy load / light load, etc.).

Advertisement

5G network search capability:

“Search network fast”, “station stability” are also important factors in evaluating 5G experience. The same base station covers hundreds or thousands of mobile phones. Good 5G mobile phones can comprehensively improve the 5G network search and switching capabilities, achieve a high 5G network share, and allow consumers more time to enjoy the 5G experience.

5G dual sim card experience:

Dual cards have gradually become standard, and simple “dual standby” only solves the space problem. Huawei’s leading smart dual card allows you to “one card VoLTE call, one card does not miss incoming calls”, and also allows you to use “one card 5G Internet access, one card VoLTE call”.

Advertisement

Yash is a graduate of computer science and followed his way into journalism, he is interested in various subjects related to technologies and politics. Yash likes to listen classical songs and has a huge library of classical mixes.

Semiconductor

Chipmakers TSMC and UMC continue to rise: Report

Published

on

TSMC

Top chipmakers, TSMC (Taiwan Semiconductor Manufacturing Company) and UMC (United Microelectronics Corporation) making the semiconductor industry continue to rise in Q4, say a report. The wafer duo of TSMC (2330) and UMC increased by 10%, up to 20% respectively.

Moving ahead, the power management and driver ICs are still soaring with a possibility of price increase for some products. However, the power management ICs may be out of stock all the way until the second half of next year.

Ups and Downs in Production Capacity:

According to the report, TSMC and UMC’s production capacity will remain tight for this season as well. Besides, a previous report on this matter reveals that TSMC cloud increase price corresponding to the market and customers.

In this line, the new price list has been activated since August for some customers meanwhile some of them will start from October. This new adjustment results in a 15-20 % increment in the mature process and 10% in the advanced process.

Advertisement

Moving to the UMC, this company also preparing for an increase before the end of the fourth quarter. The new regulation will have an average increase of 10% since November simultaneously increasing some processes by 15%.  With the help of price increases in the semiconductor industry,  the market analyzers forecast that TSMC and UMC’s revenue, gross profit margin, and net profit after tax will continue to rise.

 IC Chips and Design:

The report further reveals that the Taiwanese chip boundaries are rising chip foundries and launching countermeasures. Furthermore, the chip price increase from anonymous IC design firms in the first half has been shown on the packaging and testing of the products.

TSMC

In addition, July, August, September to November, and December are also expected to keep the same flow. If the customers want express delivery, they have can only adjust prices for the moment. Besides, the makers also are in negotiation with customers.

For instants, TSMC has increased by 20% while the other manufactures are still considering the price increase strategy. The dilemma is to whether to only increase the price for TSMC invested product of all products coming next.

Advertisement

Conclusion:

This reports revelers around the power management IC factories in Taiwan alongside Silicon Power, Mota, Zhixin, Analogue, Tongjia, and Hongguan Electronics from China. The foundries are out of print for the power management chips. At the starting of this year, the customers were rushing for almost every item but now they are only demanding some specific parts.

Besides, Novatek and Tianyu are still ruling the driver IC market. And the present conditions aren’t favorable in the TV market so makers are reducing the price. Still, the driver IC inventory occupies small marketing, so that the price increase is acceptable for the customers.

Adding to this, driver chips such as power management ICs are mostly produced by 8-inch factories. However, their production capacity is tight currently. Thus, only some driver IC quotations are likely to be increase prices at present.

(Via- Ithome)

Advertisement
Continue Reading

Semiconductor

Huawei developed low-latency image transmission technology, supporting 8K resolution

Published

on

Huawei Smart Screen Smart TV 98 inch

Huawei’s chip-making subsidiary, HiSilicon has announced to development of new low-latency image transmission technology to enriches multi-screen devices and enhanced the interactive streams experience.

Although Huawei faces a huge decline of about 88% in 1stQ 2021  but still, it wants to continue the research and development for bringing new technologies in the chip industry.

And now we can see the results of their hard work in the new Huawei HiSilicon image transmission technology to increase the image quality measurements mostly during live broadcasts.

HiSilicon Chips

HiSilicon Image Transmission Technology:

This new technology provides a full stack of solutions for high definition, (HD), ultra high definition (UHD), 4K, and 8K devices. You can see the dried description below-

Advertisement
  • Lower Latency: HiSilicons’ self-developed HiAir ultra-low latency image transmission technology aims to establish a new standard by the next 3 years. it provides a combined benefit of Huawei Cast Plus, automatic device discovery, minimalist connection, and controlled experience.
  • Protocol Deep Optimization: Huawei designed this technology with the Huawei Cast Plus, DLNA, Miracast, and Lelink.
  • Low Memory Design: The image transmission technology uses lesser memory during processing with strong scalability.
  • High Energy Efficiency Ratio: A User only has to connect the TV USB for electricity supply, during the whole process the temperature won’t go over 40 degrees.
  • UHD Image Quality: This new technology will increase the industry’s image quality performance qualification (PQ) standards and provides the most compatible UHD image for media streaming.

Previous News:

In the previous month, HiSilicon opens the recruitments across various locations mainly including Beijing, Shanghai, Shenzhen, etc, for university freshers to provide them an opportunity to jointly develop future technologies. Furthermore, the recruitment categories include Chip, Hardware, Research, Software, Testing, and System.

It’s reported that Huawei wants to keep researching on chipsets and wants to develop its own semiconductor technologies to shrink dependence on other chip manufacturers.

(Via- Ithome)

Continue Reading

Semiconductor

SK Hynix begins 1anm DRAM mass production, aims to complete by the second half of 2021

Published

on

Today, the worldwide semiconductor supplier- SK Hynix officially announced that the company has initiated the mass production of 1anm DRAM-based, 8 Gigabit LPDDR4 mobile chip.

Furthermore, it’s the first time in the history of SK Hynix to work o the EUV (Extreme Ultraviolet) device in mass production. Before, the company used lithography technology for its 1ynm DRAM production.

To date, SK Hynix has been introduced three kinds of 10nm DRAM-based mobile chip generation. Stating with 1x, 1y, 1z, and now the company is bringing 1anm, which is expected to reach the smartphone manufacturers by the second half of 2021.

The company believes that the advantage of  EUV equipment in chip production leads to the increased productivity, and further boosts cost competitiveness. The expected increase is 25% in terms of productivity.

Advertisement

The forthcoming product realizes a 4266Mbp stable transfer rate with 20% of reduced power consumption. Apart from this, the company also plans to implement the 1anm technology to DDR5 device debuted in October 2020 in the coming year.

The Vice-President of the company- Cho Youngmann stated that the 1anm DRAM features the most advanced technology with the reduced investment will serve the company in two aspects. First, it’ll bring high profitability, and secondly, it’ll help the company to position itself as the leading technology.

To be mentioned, LPDDR4 stands for Low Power Double Data Rate, which is the fourth generation of the 10nm process technology. This chip is specially designed for smartphone devices.

About SK Hynix:

The SK Hynix is a well-known South Korean firm that works on the manufacture and sales of semiconductor devices. It’s a worldwide provider of mobile chips, which mainly includes Dynamic Random Access Memory chips (DRAM), flash memory chips (NAND Flash), and CMOS Image Sensors (CIS).

Advertisement

(Via- SKhynix)

Also, Read

Huawei plans new chip manufacturing technology, aims lesser chirp frequency

Continue Reading