90 Chinese companies including Huawei, HiSilicon and Xiaomi wants to form a community to build China’s own semiconductor industry

According to the Ministry of Industry and Information Technology in China, 90 companies have submitted the application for the formation of the National Integrated Circuit Standardization Technical Committee. The secretariat is planned to be established in the China Electronics Standardization Institute.

The semiconductor is one of the most severely stuck industries in China and most of these industries are either small-scale or weak in technology so they need to cooperate in groups.

The purpose behind the creation of the committee is to coordinate weak industries and the promotion of integrated circuit standardization work and strengthen the standardization team building.

The list of 90 companies includes Huawei, HiSilicon, Xiaomi, Datang Semiconductor, Unichip Microelectronics, Zhanrui Communication, ZTE Microelectronics, SMIC, Datang Mobile, China Mobile, China Unicom,  ZTE, Tencent, and more.

Additionally, the application mentioned that the current standardization of integrated circuits is mainly in charge of the IC Sub-committee of the SAC/TC78/SC2 National Semiconductor Device Standardization Technical Committee

As per the application form, this Committee will be established to focus on the research and formulation of the following standards:

It improves the relevant standards for the assessment of integrated circuit products and promoting the connection between upstream and downstream industries, reducing development and operating costs, establishing a good industrial ecology, and enhancing the comprehensive competitiveness of the industry.

Track the development of emerging packaging technologies, focusing on the standardization of high-density FC-BGA packaging, wafer-level 3D rewiring packaging, through-silicon via (TSV) packaging, SiP RF packaging, packaging, and ultra-thin chip 3D stacked packaging technologies, And solidify the results into assessment procedures and requirements for flip-chip bonding, chip-scale packaging (CSP), wafer-level packaging (WLP), and system-in-package (SiP).

It conducts research and standard formulation in response to the performance, reliability, and information security requirements of integrated circuit products in emerging applications.

Carry out parameter index system and quality assurance element research, formulate blank detailed specifications, so as to provide a basis for the preparation of detailed specifications for integrated circuit products, and ensure that product parameter indicators can fully meet the performance requirements, reliability requirements and information security of integrated circuits in the above application fields Guarantee requirements.

Improve the standard system of test methods, mechanical and environmental test methods, and ensure that the test and test of various parameter indicators have standards to be followed.

Second, it carries out standard research and formulation of integrated circuit process control including the analysis of the standardization of collaborative innovation in various links such as integrated circuit design, software development, system integration, content, and service around the industrial chain of key areas such as mobile smart terminals and network communications.

To strengthen the formulation of design assurance standards such as design process quality control requirements and design verification requirements, and to develop in concert with all links of the industrial chain.

Strengthen the formulation of process control standards such as process control technology application guidelines, process selection guidelines, process inspection specifications, and solidify to improve the level of integrated circuit manufacturing processes.

Combined with the development of advanced packaging technologies (such as high-density three-dimensional system integrated packaging), strengthen the formulation of guiding standards for packaging material evaluation and packaging process evaluation.

(Via)