Huawei’s next application processor for smartphone is currently under development with TSMC’s 7nm EUV proceeder, and it’s being said the company is planning to develop modem-integrated 5G mobile SoCs.
Huawei’s chipmaking division HiSilicon is planning to develop its 5G mobile SoC integrating a modem chip, as well as a 5G mmWave solution for smartphones after release its Kirin 985 series processor in the second half of this year, reported Digitimes citing industry sources.
“The Kirin 985 series SoCs support Huawei’s high-end 4G smartphones, and can also come with add-on Balong 5G modem chips to support the vendor’s 5G sub 6GHz smartphones, dubbed Mate 30 series, set to be released in the fourth quarter of the year,” said the source.
it’s also reported that HiSilicon has had its new mobile processor under trial production at TSMC in the second quarter to lead way for mass production in the third quarter.
Following Qualcomm 5G deployments, HiSilicon is also aggressively moving to roll out its 5G SoC’s integrated SoC’s with modem chips between late 2019 and early 2020, which are expected to become the mainstream AP solutions for upcoming 5G smartphones, the sources said, adding it will also head start into the segment of mmWave 5G smartphone AP in early 2020.
The sources also said that Qualcomm and HiSilicon are striving to become the top 2 suppliers of 5G SoCs, with apple is expected to join the 5G market by 2020.