Today, chipmaker MediaTek announced its first chip made with TSMC‘s 3nm processing technology. This new chip will come under its flagship Dimensity lineup. It is confirmed that the launch of this chip along with volume production will happen in 2024.
According to the information, TSMC’s 3nm process technologies bring performance improvement, better power management, and yield rate. In terms of numbers, the 3nm technology currently offers as much as 18% speed improvements at the same power input as its predecessor and up to 60% increment in logic density.
MediaTek also hailed its partnership with Taiwan’s TSMC and said that both firms have collaborated to make a high-performance chip.
“We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek.
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC.
MediaTek announced that the first 3nm Dimensity flagship chip will be used in smartphones, tablets, smart cars, and various other devices starting in the second half of 2024.
(source – MediaTek)