Last September, Honor Play 3 launched in China, equipped with a punch-hole display, tripel camera, and 12nm Kirin 710F. According to some new information, the company is planning to launch this smartphone with a new processor.
According to a Weibo tipster, Honor Play 3 will relaunch with a new Kirin 710A chipset, which is reportedly 14nm processed and manufactured by Semiconductor Manufacturing International Corporation (SMIC) China.
The tipster also suggests that the specs of the device will remain the same as the previous Honor Play 3. Still, there’s no official confirmation on this matter at the moment but it may come soon.
Honor Play 3 Specifications:
Honor Play 3 is equipped with a 6.39-inch display with HD+ resolution and hole-punch design. This phone is powered by a 12nm Kirin 710F processor with 4/6GB RAM + 64/128GB internal storage (upgradable to 512GB via microSD).
For photography, the phone has triple camera setup including a 48MP (f/1.8) main + 8MP (f/2.4) 120-degree ultra wide-angle + 2MP (f/2.4) depth and an 8MP (f/2.0) front-facing camera for selfies enhanced with AI capabilities.
Honor Play 3 runs EMUI 9.1.1 based on Android 9 and packed with 4000mAh battery. The phone comes featuring EROFS, Ark Compiler, AI, Accelerations, GPU Turbo 3.0, and another new technology for performance enhancement.
Honor Play 3 is available to purchase in China in Black, Blue, and Red color options and starts at 999 yuan ($140).