Teardown suggests Huawei Pura X is using Apple-like Kirin chip design

Huawei Pura X is getting attention for its innovative design and powerful 5G Kirin chip, but a new teardown suggests the company used Apple-like chip packaging for its foldable. This hints that the firm is gradually improving its chips’ performance.

The Chinese tech giant aims to make a strong comeback in the smartphone market. This is mainly possible via innovation, AI features, and chip advancements.

As of now, the Pura X teardown reveals that Huawei has used an upgraded Kirin 9020 5G chip for it. The chip is fabricated on a 7nm process node but has an Apple-like SoC design.

Kirin 9020 chip for Pura X uses an integrated memory on the chip, which is yet to be introduced in Snapdragon and Dimensity processors. Apple is the only one to use such a technique for its A series chipsets.

Such types of processors use a CPU at the bottom, while an integrated memory is at the top. This increases the overall thickness of the chip but enables it to boost the transmission efficiency between the chip and the integrated memory.

At the same time, it occupies less space in the device. To sum up, the teardown implies that the Kirin 9020 5G for Pura X has been made with a wafer integration technique similar to Apple’s chip packaging.

iPhone maker uses an InFO (Integrated Fan-Out) chip packaging setup. Now Huawei is the only company after Apple to use a fan-out chip packaging for its devices. Even Qualcomm and MediaTek are currently out of this phase. But TSMC could launch such a tech this year.

This chip design ensures improved heat dissipation and offers enhanced performance. Pura X Kirin 9020 chip has rounded solder joints and shows clear, straight lines. It suggests that the company is striving to deliver optimized performance.

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