Teardown shows Huawei MateBook Fold chip larger than Apple M series SoCs

Huawei launched the MateBook Fold Ultimate PC last month with several new features and a mysterious Kirin chip but a recent teardown unlocks the chipset mystery of the device. It seems there’s a lot more to explore about the rumored Kirin X90,

A Weibo blogger has performed the Huawei MateBook Fold PC teardown and found some new details regarding its chip. Its codename is HiSilicon Hi 9600.

The processor further shows a familiar figure – 2035 CN. This number has also appeared on many other Kirin chipset versions like the 9020, 9010, and 9000s 5G.

Details reveal that the new Kirin chip is larger than the Apple M series SoCs in terms of size. Such processors can increase heat dissipation and enable the device to perform seamlessly without the risk of overheating or any type of degradation.

On the other hand, a large chip can contain more transistors, which can result in higher computational power and memory capacity, compared to smaller chipsets.

Teardown shows Huawei MateBook Fold chip larger than Apple M series SoCs (Image Credits: Weibo)

Inputs further reveal that Huawei has used HiSilicon chips for other key components/modules like Wi-Fi, Bluetooth, Nearlink, power supply, and more.

Huawei has focused on implementing more Chinese components instead of foreign parts in its first foldable PC. The teardown also showcased the new and largest basalt waterdrop hinge fused with a 3-part folding mechanism. It uses mortise and tenon architecture to boost its stability and reliability.

Huawei MateBook Fold Ultimate Design PC teardown reveals hinge mechanism (Image Credits: Weibo)

Details related to other parts of the new HarmonyOS-powered folding PC are unknown. But it is clear that over time, the company has significantly improved Kirin chipsets for its devices.

A recent leak suggested that Huawei has two more HarmonyOS notebooks in the pipeline. Perhaps the company may use the same X90 chipset or one of its new derivatives with enhanced cores for the upcoming PCs.