Connect with us

Semiconductor

OpenHarmony 3.0 operating system adapted to Loongson 1C300B chip

Published

on

OpenHarmony 3.0 1C300B chip

According to the latset news, OpenHarmony 3.0 was transplanted to the Zilong development board with MIPS ARCH and 1c300B chip transplantation within a week. However, at the moment, the multitasking switching, interrupts and systic have been ported.

Additionally, Tasks can be run and contexts switched normally. There are several key-press and LED code examples built into the code. The code is currently open source, allowing more developers to participate and improve together.

About Loongson 1C300B chip:

The 1C300 is a cost-effective single-chip system based on Loongson’s GS232 processor core. It has a built-in floating-point processing unit, supports multiple types of memory, supports large-capacity MLC flash memory chips, and can be used in industrial control, Internet of Things and other fields.

Advertisement

Currently, the latest OpenHarmony 3.0 supports various CPUs such as ARM, RISC-V and x86. But the current OpenHarmony 3.0 Lightweight System does not support MIPS architecture chips, only allow alone the Loongson development board with 1c300b chip.

OpenHarmony 3.0 1C300B chip

OpenHarmony:

OpenHarmony is an open source project of HarmonyOS operating system incubated and operated by the OpenAtom Foundation. The goal is to build a framework and platform for a smart terminal device operating system and promote prosperity for a full-scenario, fully connected and fully smart era.

OpenHarmony 3.0:

OpenHarmony 3.0 will pave our way to the HarmonyOS 3.0 operating system version and it is  based on the OpenHarmony 2.2 Beta 2 and brings substantial improvements over the past versions.

(Via – ithome)

Advertisement

Amy is our firmware and software specialist, she keeps her eagle eyes open for new software rollouts, beta programs, and other software related activities as well as new smartphone launch.

Semiconductor

TSMC will rip off Samsung for 80% of 3nm chipsets

Published

on

By

Samsung TSMC

3nm is the next stop for mobile chipsets and Taiwan’s TSMC will rip off Samsung for 3nm chipset orders from customers such as Apple, Qualcomm, and MediaTek.

According to a report from Taiwanese media, experts in the study of semiconductors revealed that the current 3nm yield rate is estimated to be about 60% to 70%, or even more than 70%.

Another multinational industry analyst estimated that the current yield rate of TSMC’s 3nm process may fall to about 75%-80%. “There has been such progress in the early stage, which is very impressive.”

The latest input suggests that TSMC has taken the lead in 3nm chip orders and rip off most of the orders from Samsung. In June 2022, Samsung became the first foundry business to announce the initial production of its 3nm process node.

Advertisement

At that time, Samsung’s 3nm yield rate was less than 20 percent and some wafers even had a yield rate of only 10 percent. An industry analyst says, Samsung actually doesn’t know where the fault is.

TSMC says its 3nm process is the most advanced semiconductor technology in both power, performance, and area (PPA). In transistor technology, and a full-node advance from the 5nm generation.

Compared to the 5nm (N5) process, the 3nm process offers up to 1.6X logic density gain and 30-35% power reduction at the same speed and supports the innovative TSMC FINFLEX architecture.

Apple, MediaTek, and Qualcomm:

Advertisement

After Huawei HiSilicon‘s exit, TSMC’s market share was reduced because it was one of the biggest chip customers.

Still, Apple, MediaTek, Qualcomm, AMD, and Nvidia are the top customer of TSMC and Samsung Foundry business. These clients require various chip nodes throughout the year. While, Apple may still be the first to use a 3nm chipset for next year’s iPhones, followed by Qualcomm and MediaTek.

TSMC announced that it is also preparing for 2nm fabs, which will be upgraded six times than the last node process.

Samsung needs to improve:

TSMC is a long-standing chipset printer and Samsung needs to improve its Foundry business to compete against it. That’s all to suggest for the South Korean company.

Advertisement

Samsung TSMC

(source)

Continue Reading

Semiconductor

HiSilicon Tianguang 800 chipset news is fake: Huawei

Published

on

HiSilicon Tianguang 800 fake

Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.

The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.

Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.

According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.

Advertisement

Huawei HiSilicon:

On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.

In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.

During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.

(Source: ithome)

Advertisement
Continue Reading

Semiconductor

Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022

Published

on

Huawei HiSilicon Tianguang 800

Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.

This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.

Huawei HiSilicon Tianguang 800

HiSilicon Tianguang 800 chip:

Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.

Huawei HiSilicon Tianguang 800

Huawei HiSilicon:

Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.

On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.

Advertisement

Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.

(Via: ithome)

Continue Reading