Huawei aims to build a wafer fab manufacturing with the help of SMIC in Shenzhen, China reported by Chinese Media. The SMIC is the largest wafer fab and contract chip maker in mainland China. Also, Huawei’s initial investment to build a water fab factory will be around ten billion dollars.
According to the information, Huawei’s chip design capabilities and SMIC’s semiconductor manufacturing technology have also approached TSMC’s supply chain for cooperation to expand independent chip manufacturing capabilities through official fundings.
However, the report mentioned underquotes that “Recently, Huawei has come to us to help build a fab in the mainland.” Also, it is added in the report that the industry believes that money is not a problem for Huawei.
The major focus of Huawei is on how to get a sufficient amount of equipment and plant resources, and how to start mass production. This time, Huawei has closed relevant members of the “TSMC Alliance” and with new hope using the experience of previous alliance members to assist TSMC’s fabs, shortening the learning curve of self-built fabs and rapidly entering mass production.
Furthermore, Huawei is looking for partners to promote its fab plan, and SMIC will be working with Southern. Due to official funding support from the mainland, the investment amount of individual companies is still unclear.
At the moment, it is still rumored that the Huawei wafer fab manufacturing factory will be built in Shenzhen to meet Huawei’s own needs. The industry pointed out that Huawei’s active self-made wafer should be the first step for the fab group. It will gradually evolve from IC design to integrated component (IDM) not only for smartphones but also for local manufacturing of chips such as Netcom.
Regarding this, Huawei has not made any announcement yet and responded on this matter yet. Meanwhile, Huawei has established a new precision manufacturing company with a registered capital of 600 million yuan on December 28 in China.
Moreover, it was also rumored that Huawei is going to build its own chipsets in this industry. But, Huawei insiders responded that Precision Manufacturing Co., Ltd. has a certain level of mass production and small-batch trial production (capabilities), but this is mainly for Huawei’s own products.
TSMC will rip off Samsung for 80% of 3nm chipsets
According to a report from Taiwanese media, experts in the study of semiconductors revealed that the current 3nm yield rate is estimated to be about 60% to 70%, or even more than 70%.
Another multinational industry analyst estimated that the current yield rate of TSMC’s 3nm process may fall to about 75%-80%. “There has been such progress in the early stage, which is very impressive.”
The latest input suggests that TSMC has taken the lead in 3nm chip orders and rip off most of the orders from Samsung. In June 2022, Samsung became the first foundry business to announce the initial production of its 3nm process node.
At that time, Samsung’s 3nm yield rate was less than 20 percent and some wafers even had a yield rate of only 10 percent. An industry analyst says, Samsung actually doesn’t know where the fault is.
TSMC says its 3nm process is the most advanced semiconductor technology in both power, performance, and area (PPA). In transistor technology, and a full-node advance from the 5nm generation.
Compared to the 5nm (N5) process, the 3nm process offers up to 1.6X logic density gain and 30-35% power reduction at the same speed and supports the innovative TSMC FINFLEX architecture.
Apple, MediaTek, and Qualcomm:
Still, Apple, MediaTek, Qualcomm, AMD, and Nvidia are the top customer of TSMC and Samsung Foundry business. These clients require various chip nodes throughout the year. While, Apple may still be the first to use a 3nm chipset for next year’s iPhones, followed by Qualcomm and MediaTek.
TSMC announced that it is also preparing for 2nm fabs, which will be upgraded six times than the last node process.
Samsung needs to improve:
TSMC is a long-standing chipset printer and Samsung needs to improve its Foundry business to compete against it. That’s all to suggest for the South Korean company.
HiSilicon Tianguang 800 chipset news is fake: Huawei
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon Tinaguang 800 chip news is “fake news”.
The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.
Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.
According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.
In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.
During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.
Huawei HiSilicon Tianguang 800 chip spotted, launching in 2022
Early this month, Huawei Kirin sent the New Year 2022 wishes and stated to continue to set off in 2022 and move towards the “chip”. According to the latest information, the new Huawei HiSilicon Tianguang 800 chip has been spotted with the HiSilicon logo and is expected to launch soon this year.
This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.
HiSilicon Tianguang 800 chip:
Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.
Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.
On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.
Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.