On May 6, Huawei published another patent for chip stack packaging with announcement number CN2114450786A, which was applied on October 30, 2019. . Last month, the Chinese tech marker discloses a technology to reduce the cost of chip packaging.
The latest patent technology for chip packaging aims to solve the problem of how to reliably bond multiple secondary chip stacking units to a single main chip stacking unit. As we are familiar with Huawei’s chip shortage issue going on for a long time.
The chipset is the most important and core component that will be equipped in any device. Therefore, Huawei is innovating new ideas and securing them in the form of patents for future use. So, let’s explore Huawei’s new idea for chip packaging in detail.
New structure for chip packaging:
A main chip stacking unit has a plurality of main pins on the first surface that are insulated and arranged at intervals.
The first bonding layer is arranged on the first surface. The first bonding layer includes a plurality of bonding components that are insulated and arranged at intervals.
Each of the plurality of bonding assemblies includes at least one bonding portion, any two bonding portions are insulated and disposed of, and any two bonding portions have the same cross-sectional area. The plurality of bonding assemblies is respectively connected to the plurality of main pin keys combine.
A plurality of secondary chip stacking units is arranged on the surface of the first bonding layer on the side away from the main chip stacking unit.
The sub-chip stacking unit has a plurality of micro-bumps that are insulated and spaced apart. Each of the plurality of micro-bumps is bonded to one of the plurality of bonding components.
New Huawei patent for smart car can identify users’ objects of interest
Huawei has recently appealed for a patent regarding smart car technology. Although, the company is busy dealing with the development process of flagship models and the distribution of updates. Yet, in the meantime, the company is also constantly peaking into the latest innovation techniques.
According to the reports, the new Huawei patent for the smart car is formally entitled Identification Methods and Identification Device for Objects Of Interest to Users. Generally, the patent gives information about some new identification methods for intelligent vehicles.
These identification methods comprise the following actions:
- Tracking information about the gaze area of the user’s line of sight
- Actively responding to the respective surrounding image
- Obtaining the user’s first gaze area data according to the surrounding image
Some users might be thinking of what a gaze area is. Well, the latest smart vehicles consist of a gaze section. This system helps in tracking what you’re looking at, outside of the car, and thereafter reflects relevant information on your device of the display technology is your car.
Apart from covering these phases, the patent also acknowledges the Recognition method for smart vehicles. These methods aim mainly at the gaze area of the user and make it more accurate and effective for the user.
So far, the traditional gaze systems used to present only a few identical physical parts of the human body after tracing the details. On the other hand, it only reflects the information when the target used to appear in the main section of the gaze system.
But, the new identification methods, will define the image as well as the surrounding with more accuracy. Further, it will improve the object recognition of interest to the user to more extent. As a result, users would be able to catch a clear and more detailed view of the surrounding image.
Huawei has a new mobile screen sharing feature between two phones
In the last three years, Huawei has started many new tech ventures to solve its tech issues and continuously researched new technologies to enhance existing devices. Adding to this, Huawei has recently patented a unique mobile screen sharing feature technology that will allow phone users to connect the display of each phone in real-time.
According to the information, Huawei has recently published a new patent for “An Enhanced Screen Sharing Method and System Electronic Equipment” with publication number CN114647390A. However, there’s a lot that we can learn from the Huawei mobile screen sharing feature patent description.
The details of the patent reveal that the first device (A) shows the user interface and sends it to the second device (B). Then the B receives the data as well as the user interface and shows it as it is on the display.
Aside from showing the display interface, the entire feature has a name called – Linkage Mode, which allows users to operate A device directly from the B device, which is kind of a Super Device feature feel.
The operation includes triggering events such as user interface clicks, drag, and drops as well as slides and gestures, similar to an operational smartphone. To perform responsive actions, the second device sends the events to the first device and performs the actions in real-time, according to the corresponding feature.
The patent image also shows how this technology really works for the consumers and how it shares the screen in real-time while performing actions from B to A devices. This technology is awesome and it will surely improve the user experience for the Huawei smartphone users.
As of now, Super Device and Multi screen collaboration allow you to connect the mobile screen to a desktop, laptop, tablet, or other big screen devices but it’s interesting to see, a mobile projecting the screen from another mobile display and taking direct actions from there.
Currently, Huawei has not confirmed to use or adapt this technology in real-time but we’re waiting for more information, as the technology currently remains in patent design.
Huawei files patent for Quantum Chip and Computer
Huawei has recently issued a novel invention patent related to the Quantum chip and computer. The company published the respective patent with a specified number as CN114613758A. According to the latest information, the current Huawei patent offers a quantum chip as well as a computer to solve the low yield issues. Since the implementation relates to quantum computing technology, it will ease the production of quantum chips.
Consequently, the quantum chips will comprise the following elements:
- A coupling structure, cavity mode suppression structure, M sub-chips, and a substrate
- The M sub-chips arrangement takes place on the surface of the substrate with gaps
- Each sub-chips consists of N qubits
- The coupling structure maintains the interconnection between the M sub-chips
- The cavity mode suppression structure is at the edge of each sub-chip. It is also in the gap of the M sub-chips to increase the cavity mode frequency of the quantum chip
Here, the term M and N refers to a positive integer. M is greater than 1, meanwhile, N is greater or equal to 1. The M sub-chips in the quantum chip will reduce the strain of manufacturing and will improve the production yield.
It’s not the first time when Huawei is dealing with the Quantum theories. Back in January 2021, the Chinese manufacturer obtained a “quantum key distribution system, method, and device” patent.
Further in time, the Ministry of Industry and Information Technology declared the very first quantum random number industry. This industry gained the name Key Devices and Modules for Quantum Key Distribution. It was mainly based on BB84 Protocol Part 3: Quantum Random Number Generator. Alongside Huawei, several institutes of technology took part in the preparation.