Huawei could tape out 3nm chip by 2026 despite growing sanctions

A report has it that Huawei could introduce a 3nm chip as early as 2026. As per the details, the company is looking for a new technology that can help it produce advanced SoCs for its products. The report surfaced amid US-China tech tensions.

Huawei and SMIC have been planning 3nm chipmaking for a long time. The firms reportedly laid production lines for a 5nm SoC, aiming to shift gradually to a 3nm process. But the constant pressure from the US halted the procedure.

Looks like the company didn’t give up on its plans. After an alleged 5nm Kirin X90 processor for HarmonyOS PC, Huawei is rumored to tape out a 3nm chip in 2026.

Economic Daily reported that Huawei has commenced the R&D work for 3nm chips through GAA surround gate technology and two dimensional materials.

GAA or Gate-All-Around is a technology that surrounds a chip channel on all four sides to allow better control of the transistor switch. It not only boosts performance but also reduces energy consumption and chip area to a greater extent.

Samsung is the only brand using the GAA technology for its 3nm chipsets at present. This tech eliminates current leaks and improves the overall drive current.

Apart from the GAA tech, Huawei will switch to 2D materials instead of using the regular silicon design. The report adds that the company will opt for carbon nanotubes instead of silicon transistors for better energy efficiency.

Kirin chipset (Image Credits: HiSilicon Kirin)

Inputs further say that Huawei will use the GAA technology to tape out its 3nm chipset next year. Here, “tape out” refers to the final stage of chip design before sending it to the fabrication for manufacturing. Thus, the Chinese OEM could send a 3nm chipset design to its chipmaking partner SMIC next year.

US and China are busy in the tech battle these days. The foreign authorities are trying every possible way to corner Huawei Ascend AI chips. On the other hand, the Chinese Ministry is hitting back at the US for its unilateral restrictions.

Despite this tech war, Huawei is working on improving and advancing its chip technology. It would be worth seeing whether the company will be able to design a 3nm chipset by next year or take more time following the US regulations.

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