Huawei could challenge Apple in AI smartphone race with HBM chips

Huawei seems to be working on a secret weapon that can help it race ahead of Apple in the AI smartphone category – HBM chips. A new leak suggests that the Chinese OEM is dreaming bigger for its smartphones this time, with powerful upgrades.

DigitalChatStation hints that Huawei can bring HBM DRAM smartphones way before Apple. If true, it would be a major challenge for the iPhone maker in the AI smartphone race.

HBM or high bandwidth memory is a type of computer memory designed for high-speed data transfer and to reduce power consumption. It is also known as high-performance DRAM, which relies on 3D stacking tech to improve data flow.

It further reduces the size of memory chips and is well-suited for AI and high-performance computing. Thus, HBM is the only way to develop highly AI-powered smartphones.

Certain reports on the internet say that Apple is considering integrating AI HBM chips into iPhones. Although this process will take a couple of years. Hence, iPhones launching in 2027 could be the first HBM-powered Apple handsets.

(Image Credits: Weibo)

The iPhone maker will likely take the help of Samsung and SK Hynix in this process, as HBM suppliers. But Huawei might take over this place with the first HBM-driven phone launch!

As per the latest leak, Huawei could be the first to power an AI smartphone with HBM chips, over Apple. The firm joined hands with many Chinese firms and even began developing HBM chips, since it couldn’t rely on foreign suppliers following the US export controls.

Early reports say that Huawei may develop HBM chips by the end of 2026. Although neither Huawei nor Apple has confirmed these claims so far. But we grab more details on this matter in the coming days. Stay tuned.

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