Semiconductor
Huawei Ascend 920 AI chip could officially debut in H2 2025
Huawei has reportedly built the successor of the 910C AI chip – the Ascend 920, which could go official in H2 2025. A new input says that the company has scheduled the mass production of its next-gen AI semiconductor for the second half of this year.
Inputs from DigiTimes hint that Huawei will begin mass producing Ascend 920 AI chips in H2 2025. Many industry experts believe that this particular chipset can fulfill the Nvidia H20 void in China created by the latest U.S. restrictions.
Perhaps the Ascend 920 will play a major role in revamping the Chinese AI chip industry and computing capabilities. It will reduce the reliance of big Chinese customers like ByteDance, Tencent on Nvidia and attract them towards Huawei.
Specifications:
The Ascend 920 chipset will be based on SMIC’s 6nm (N+3 node) process technology. It can deliver 900 TFLOPS of BF16 and 4000 GB/s of memory bandwidth with the help of HBM3 memory modules.
It has the same design as the Ascend 910C but claims to offer 30 to 40% improved and faster training efficiency than the 910C. Hence, it may perform better than Nvidia H20. The new SoC can support PCIe 5.0 and the next-gen of high-throughput interconnect protocols. optimizing resource scheduling and cross-node collaboration.
Further inputs say that the Ascend 920 chip has enhanced tensor operation accelerators. The company has optimized this segment for Transformer and MoE models.
The new AI chip is capable of meeting the larger and more complex models’ training requirements. Looks like Huawei has produced this processor to patch the void created by Nvidia H20, following the newest U.S. trade export regulations.
It is unclear how the new processor will perform in real-time scenarios. But if based on 6nm process, we can expect better efficiency and functioning than other Ascend chips.
Huawei Ascend 920 AI chip could officially debut in H2 2025 ((Image Credits: Huawei)
