Honor Magic V Flip 2 could equip Snapdragon 8 gen 3 chipset

Honor Magic V Flip 2 foldable is in the making and expected to debut with the previous-gen Snapdragon 8 Gen 3 chipset. While many netizens were speculating the Elite processor, the company may stick to an old chip for its next clamshell.

Weibo tipster @DigitalChatStation reveals that the upcoming Honor Magic V Flip 2 could use the Snapdragon 8 Gen 3 chipset. It may not feature any new processor.

Snapdragon 8 Gen 3 chipset has a configuration of one ARM Cotext-X4 prime core clocked at 3.3GHz, five ARM Cortex-720 performance cores with a 3.2GHz frequency, and two ARM Cortex-520 efficiency cores clocked at 2.3GHz frequency.

For reference, the Honor Magic V Flip foldable uses the Snapdragon 8+ Gen 1 (4nm) chipset. The upcoming model is expected to bring a significant chip upgrade but is unlikely to be the latest Snapdragon processor. Things will get clear in the future.

Inputs further reveal that the Honor Magic V Flip 2 may use a customized LTPO screen for the front and back. The company could introduce a new display solution for its upcoming folding phones. Although the details are currently a mystery.

Honor Magic V Flip 2 could equip Snapdragon 8 gen 3 (Image Credits: Weibo)

Magic V Flip

Honor Magic V Flip sports a foldable LTPO 6.8-inch main screen and a 4-inch LTPO cover screen. These panels support 120Hz, Dolby Vision, 405PPI, and HDR effects.

The device comes out of the box with Android 14-based MagicOS 8. It is now upgradable to the MagicOS 9.0 version. It has a dual-camera setup on the back, including a 50MP main camera and a 12MP ultrawide-angle shooter.

Meanwhile, the front side has a 50MP main selfie snapper. It packs a battery with 4800mAh capacity, 66W wired, and 5W reverse wired charging function.