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China steps towards EUV chipmaking tech amid tighter US sanctions

China is constantly looking for innovative approaches toward advanced chipset development and one such is – EUV. Despite tougher restrictions and US chip controls, China is working on EUV (Extreme UltraViolet) lithography chipmaking tech.
U.S. sanctions have prevented China from making advanced semiconductors. The country can’t access EUV and other high-end chipmaking tools from US states.
Looks like China has found a new way to develop EUV chipmaking tech amid US restrictions. Inputs reveal that the Harbin Institute of Technology received the first prize for one of its projects related to the EUV laser light on December 30, 2024.
As per the Institutes’ official website, the discharge plasma EUV light source project is capable of boasting high energy conversion efficiency, low cost, compact size, and relatively low technical difficulty. It is led by Professor Zhao Yongpeng.
“It can produce extreme ultraviolet light with a central wavelength of 13.5nm, meeting the urgent demand for EUV light sources in the photolithography market.”
EUV machines play a vital role in making advanced semiconductors. They can help to make chips smaller than 7nm. ASML is currently the only company to produce EUV tools. While many countries can use this tech, China is away from this blessing.
ASML can’t ship EUV chipmaking technology to China following the US export controls. The Netherlands further expanded these restrictions on chip-related items on January 15. But China found a new approach in this matter with its hard work.
China’s EUV laser light uses the LDP (laser-induced discharge plasma) method. It vaporizes a small quantity of tin into a cloud between two electrodes. These electrodes use high voltage to convert the tin cloud into plasma. The electrons and high-valence tin ions collide and radiate several times, forming the EUV light.
ASML uses LPP (laser-produced plasma). The process needs high-energy laser parts and complex FPGA chip control. Compared to ASML, China’s current approach is simpler and more cost-effective. It is further capable of turning electrical energy into plasma directly with better energy efficiency.
Yet certain challenges persist. For instance, optimizing the parameters and time of discharge pulses. Another struggle could be the power output limitations.
Anyways, after the long-running U.S. sanctions, China’s new and innovative approach towards high-end chipmaking technology hints that the country will soon master the EUV tech development.

China steps towards EUV chipmaking tech amid tighter US sanctions (Image Credits: ASML)
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