Huawei has applied for a new patent in the chip wafer processing technology to enhance the wafer alignment efficiency. The patent is entitled ‘Wafer Processing Device...
Huawei aims to build a wafer fab manufacturing with the help of SMIC in Shenzhen, China reported by Chinese Media. The SMIC is the largest wafer...
A new report says that Huawei is paying attention to Chinese companies in order to improve chip packaging technologies. The company’s semiconductor unit HiSilicon sends an...
ASML is now rumored to raise the price of chip-making tools for TSMC. The price increment strategy will ultimately aid the chip equipment supplier in reaching...
A new report states Chinese firms have purchased $26 billion worth of chipmaking tools this year. This is a new record that might give a shock...
A Weibo tipster reported that the SMIC 5nm process has ‘better than expected’ power efficiency, and this seems good news for future Huawei phones. The alleged...
Huawei and Wuhan Xinxin have reportedly partnered to build HBM (high-bandwidth memory) chips for AI projects. Both firms aim to develop powerful and efficient components for...
Huawei Executive Director – Zhang Pingan said during his keynote at an event that the company focuses on solving the 7nm chip issues instead of looking...
Rumors regarding Huawei say that the company is planning to develop a 3nm chip despite growing challenges and U.S. pressure. The information also cites that the...
A new report has shown some good signs for the Huawei Mate 70 series as it might be the first flagship in the industry to equip...